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Banothu Rakesh
Banothu Rakesh
Gokaraju Rangaraju Institute of Engineering and Technology
Materials science
Three-dimensional integrated circuit
Through-silicon via
Optoelectronics
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4
Papers
14
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Facile approach to mitigate thermal issues in 3D IC integration using effective FIN orientation
2020
Materials Today: Proceedings
Banothu Rakesh
Kailaas Mahindra
Marri Sai Venkat Goud
N Arun Vignesh
Tatiparti Padma
Asisa Kumar Panigrahy
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Citations (6)
Noise performance improvement in 3D IC integration utilizing different dielectric materials
2020
Materials Today: Proceedings
Dadaipally Pragathi
Banothu Rakesh
P. Sriram Kumar
N Arun Vignesh
Tatiparti Padma
Asisa Kumar Panigrahy
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Citations (5)
Thermal management in TSV based 3D IC Integration: A survey
2020
Materials Today: Proceedings
Venkata Kiran Sanipini
Banothu Rakesh
Aruna Jyothi Chamanthula
N. Santoshi
A Arunkumar Gudivada
Asisa Kumar Panigrahy
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Citations (2)
Simplistic approach to reduce thermal issues in 3D IC integration technology
2020
Materials Today: Proceedings
Banothu Rakesh
Dumpa Prasad
Ch. Usha Kumari
N. Arun Vighnesh
M. Suresh
Asisa Kumar Panigrahy
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Citations (1)
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