Old Web
English
Sign In
Acemap
>
authorDetail
>
Bangze Huang
Bangze Huang
Thermal analysis
Thermal conductivity
Composite material
Chip
Structural engineering
1
Papers
0
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (1)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
The thermal analysis study of 3D bare chip laminated packaging structure
2017
Bangze Huang
Zhaohua Wu
Show All
Source
Cite
Save
Citations (0)
1