Old Web
English
Sign In
Acemap
>
authorDetail
>
munakata osamu
munakata osamu
Materials science
Soldering
Electronic component
Metallurgy
Alloy
4
Papers
0
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (3)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Alliage de soudure destiné au placage et composant électronique
2015
turuta ka iti
Kaichi Tsuruta
munakata osamu
Osamu Munekata
hiroyuki iwamoto
Hiroyuki Iwamoto
atusi ikeda
Atsushi Ikeda
hiroyuki moriuti
Hiroyuki Moriuchi
shenyiheshan
Shinichi Kayama
yosihiro tadokoro
Yoshihiro Tadokoro
Show All
Source
Cite
Save
Citations (0)
Solder alloy for plating and electronic component
2015
turuta ka iti
munakata osamu
hiroyuki iwamoto
atusi ikeda
hiroyuki moriuti
shenyiheshan
yosihiro tadokoro
Show All
Source
Cite
Save
Citations (0)
低酸素雰囲気における銅板へのSn–3Ag–0.5Cuおよび Sn–9Znはんだ液滴の濡れ性
2009
Journal of Japan Institute of Electronics Packaging
munakata osamu
yosida ryou
kano utako
satou tadao
saeki kou
Show All
Source
Cite
Save
Citations (0)
1