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Sow Chorng
Sow Chorng
Electronic engineering
Materials science
Composite material
Wafer-level packaging
Vacuum chamber
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Reliability analysis of sandwich microdisplay packaging using an integrated interferometry system
2006
EPTC | Electronics Packaging Technology Conference
Audrey C.Y. Wong
Yaofeng Sun
Sow Chorng
Su Fei
John H. L. Pang
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