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Kari Ojala
Kari Ojala
Nokia
Materials science
Electronic engineering
Electronics
Mechanical engineering
System-level simulation
5
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8
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Drop test simulation study of flexible devices
2009
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Quayle Chen
Leon Xu
Cherie Jing
Tom Xue
Bin Wang
Tiejun Zhao
Antti Salo
Kari Ojala
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Cold test and cyclic damp heat test of plastic substrate based displays
2008
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Jian-Ping Li
Ping Yang
Jian Zhong
Jun Zhou
Leon Xu
Quayle Chen
Antti Salo
Kari Ojala
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Flexible device and component reliability study using simulations
2008
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Quayle Chen
Leon Xu
Cherie Jing
Tom Xue
Antti Salo
Kari Ojala
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Reliability evaluation for solder joints in embedded electronic packages considering the effect of adhesion of the interfaces
2008
Qiang Yu
Hiroki Miyauchi
Tadahiro Shibutani
Klas Andersson
Kari Ojala
Harri Lasarov
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Characterization of dents and grooves on polymer films using Scanning White Light Interferometry
2006
Ivan Kassamakov
Kari Ojala
A. Salmi
Edward Hæggström
Juha Aaltonen
Arne Huber
H Saarikko
M. Österberg
M. Oinonen
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