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Hikaru Mizuno
Hikaru Mizuno
Materials science
Composite material
Polymer
Insulator (electricity)
Wafer
5
Papers
12
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UV laser releasable temporary bonding materials for FO-WLP
2018
ICEP | International Conference on Electronics Packaging
Hikaru Mizuno
Hiroyuki Ishii
Hitoshi Kato
Takashi Mori
Hiroki Ishikawa
Yooichiroh Maruyama
Kenzo Ohkita
Koichi Hasegawa
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Laser releasable temporary bond/de-bond materials for next 3D packages
2017
Koichi Hasegawa
Takashi Mori
Hikaru Mizuno
Hiroyuki Ishii
Yooichiroh Maruyama
Kenzo Ohkita
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Low Temperature Curable Photo-sensitive Insulator
2014
Journal of Photopolymer Science and Technology
Hikaru Mizuno
Tomohiko Sakurai
Kenji Okamoto
Katsumi Inomata
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Novel low temperature curable photo-sensitive insulator
2014
ECTC | Electronic Components and Technology Conference
Kenji Okamoto
Hikaru Mizuno
Tomohiko Sakurai
Katsumi Inomata
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Novel low temperature curable photo-sensitive insulator
2014
ICEP | International Conference on Electronics Packaging
Tomohiko Sakurai
Hikaru Mizuno
Kenji Okamoto
Katsumi Inomata
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Citations (2)
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