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Ryohei Sato

Osaka University

8

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41

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Trends and Future Prospects on System-Design Integration based on Hyper-Miniaturization, 3D-Integration and Advanced Packaging

2018 Journal of Japan Institute of Electronics Packaging
- Kazuya Okamoto
- Ryohei Sato
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Study of low load and temperature, high heat-resistant solid-phase Sn-Ag bonding with formation of Ag 3 Sn intermetallic compound via nanoscale thin film control for wafer-level 3D-stacking for 3D LSI

2013 ECTC | Electronic Components and Technology Conference
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Study on high performance and productivity of TSV's with new filling method and alloy for advanced 3D-SiP

2012 DIC | IEEE International D Systems Integration Conference
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Study on TSV with new filling method and alloy for advanced 3D-SiP

2011
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Study on Frequency Dependency of ON-Resistance and Pulse-Loss Calculation of MOSFETs for Switch Mode Power Supply

2010 Ieej Transactions on Industry Applications
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