Old Web
English
Sign In
Acemap
>
authorDetail
>
Chrandeep Singh
Chrandeep Singh
Corning Inc.
Thermal expansion
Service life
Digital image correlation
Soldering
Mechanical engineering
1
Papers
8
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (1)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
A Study of Substrate Models and Its Effect On Package Warpage Prediction
2019
ECTC | Electronic Components and Technology Conference
Van-Lai Pham
Huayan Wang
Jiefeng Xu
Jing Wang
Chrandeep Singh
Seungbae Park
Show All
Source
Cite
Save
Citations (8)
1