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Shao-feng Xie
Shao-feng Xie
Delamination
Composite material
Materials science
Thermal copper pillar bump
Soldering
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Reliability analysis and case studies on FCBGA packaged devices
2015
ICEPT | International Conference on Electronic Packaging Technology
Xiao-ling Lin
Shao-feng Xie
Ruohe Yao
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