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Takeshi Asaka
Takeshi Asaka
Composite material
Materials science
Wafer-level packaging
Chip-scale package
Electronic engineering
2
Papers
5
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0
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Lead Free Micro Bumping - Cost & Yield Challenges
2007
EPTC | Electronics Packaging Technology Conference
Klaus Ruhmer
Emmett Hughlett
Masahiko Ishizuka
Tomoaki Kojima
Takeshi Asaka
Bing Dang
Steve Buchwalter
Da-Yuan Shih
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Citations (5)
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