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Lovell Berry Wiggins
Lovell Berry Wiggins
IBM
Materials science
Composite material
Electronic engineering
Soldering
Engineering
7
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131
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NiFe-based Ball-limiting-metallurgy (BLM) for microbumps at 50μm pitch in 3D chip stacks
2013
ECTC | Electronic Components and Technology Conference
Bing Dang
Steven L. Wright
Joana Maria
Cornelia K. Tsang
Paul S. Andry
Lovell Berry Wiggins
John U. Knickerbocker
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Electrical fails specific to Pressure Cooker Test
2004
IRPS | International Reliability Physics Symposium
Lovell Berry Wiggins
Charles Hampton Perry
J. T. Coffin
E. Dyll
M. Fausse
K Masanori
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Improved glass-ceramic-copper bonding.
1992
Nunzio DiPaolo
Ananda Hosakere Kumar
Lovell Berry Wiggins
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Low-temperature heat capacity and entropy of chalcopyrite (CuFeS2): estimates of the standard molar enthalpy and Gibbs free energy of formation of chalcopyrite and bornite (Cu5FeS4)
1985
The Journal of Chemical Thermodynamics
Richard A. Robie
Lovell Berry Wiggins
Paul B. Barton
Bruce S. Hemingway
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Citations (16)
1