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B Q Wang
B Q Wang
LSI Corporation
Composite material
Materials science
Wire bonding
Copper
Oxide
3
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16
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Corrosion of the Cu/Al interface in Cu-Wire-bonded integrated circuits
2013
ECTC | Electronic Components and Technology Conference
John W. Osenbach
B Q Wang
Sue Emerich
John M. DeLucca
Dongmei Meng
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