Old Web
English
Sign In
Acemap
>
authorDetail
>
Soonwan Chung
Soonwan Chung
Materials science
Inorganic chemistry
Electronic engineering
Deformation (mechanics)
Digital image correlation
3
Papers
1
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (3)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Effects of Heat Treatment on Interfacial Behavior and Bonding Strength of Surface Activated Bonding Ti–Al Laminate
2018
Journal of Nanoscience and Nanotechnology
Chang-Been Lee
Seong-Sik Bang
Young-Chul Park
Jee-Hun Kim
Nam-Seok Kim
Seung-Ho Yang
Jae-Sung Park
Jong-Bae Kim
Dong-Ho Choi
Soonwan Chung
Changjae Kim
Taek-Kyun Jung
Soong-Keun Hyun
Show All
Source
Cite
Save
Citations (1)
Effect of Zn on Pore Characteristics in Lotus-Type Porous Cu
2018
Journal of Nanoscience and Nanotechnology
Ji-Woon Lee
Hyung-Tae Kim
Sang-Wook Kim
Taek-Kyun Jung
Changhyun Jin
Joonmo Choung
Changjae Kim
Soonwan Chung
Soong-Keun Hyun
Show All
Source
Cite
Save
Citations (0)
Experimental Assessment of Electronic Package Deformation Using Digital Image Correlation Technique
2011
Journal of Japan Institute of Electronics Packaging
Jae B. Kwak
Soonwan Chung
Show All
Source
Cite
Save
Citations (0)
1