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Akira Tamura
Akira Tamura
Fujitsu
Materials science
Engineering
Thermal
Substrate (chemistry)
Composite material
4
Papers
3
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Multilayer Glass Substrate with High Density Via Structure for All Inorganic Multi-chip Module
2019
ECTC | Electronic Components and Technology Conference
Toshiki Iwai
Taiji Sakai
Daisuke Mizutani
Seiki Sakuyama
Kenji Iida
Takayuki Inaba
Hidehiko Fujisaki
Akira Tamura
Yoshinori Miyazawa
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Glass Multilayer Package Substrate using Conductive Paste Via Connection
2018
ICSJ | CPMT Symposium Japan
Toshiki Iwai
Taiji Sakai
Daisuke Mizutani
Seiki Sakuyama
Kenji Iida
Takayuki Inaba
Hidehiko Fujisaki
Akira Tamura
Yoshinori Miyazawa
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Automatic Thermal Modeling for System Level Design of Electronic Equipment
2003
Kenichiro Aoki
Koichi Shimizu
Akira Ueda
Akira Tamura
Masanori Motegi
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of the same connector and method of assembling
1993
Akira Tamura
Hidehisa Sakai
Mikio Nishihara
Kyoichiro Kawano
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