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T. Lacrevaz
T. Lacrevaz
Materials science
Ceramic
Electronic engineering
Power integrity
Redistribution layer
2
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A Versatile Platform towards High Reliability Compact Package for Digital Chips
2017
ECTC | Electronic Components and Technology Conference
C. Ferrandon
Laetitia Castagné
B. Kholti
G. Waltener
R Lemaire
V. Puyal
J.C. Souriau
G. Simon
J P Peltier
T. Lacrevaz
L. Toffanin
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[PDF] "Characterization in a Wide Frequency Range (40 MHz - 67 GHz) of a KTa0.65Nb0.35O3 Thin Film for Tunable Applications" - Semantic Scholar
2014
Grégory Houzet
T. Lacrevaz
C Bermond
B. Fléchet
Arnaud Le Febvrier
Stephanie Deputier
Maryline Guilloux-Viry
Patrick Queffelec
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