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Yongsun Ko

Samsung

3

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27

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Tribological approaches to material removal rate during chemical mechanical polishing

2013 Metals and Materials International
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Contact Behavior and Chemical Mechanical Polishing (CMP) Performance of Hole-Type Polishing Pad

2012 ECS Journal of Solid State Science and Technology
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Investigation of ultra thin polycrystalline silicon channel for vertical NAND flash

2011 IRPS | International Reliability Physics Symposium
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