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E.S. Sprogis
E.S. Sprogis
IBM
Materials science
Electronic engineering
Wafer
Silicon
Electrical engineering
2
Papers
231
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3D silicon integration
2008
ECTC | Electronic Components and Technology Conference
John U. Knickerbocker
Paul S. Andry
Bing Dang
Raymond Robert Horton
Chirag S. Patel
Robert J. Polastre
Katsuyuki Sakuma
E.S. Sprogis
Cornelia K. Tsang
B.C. Webb
S.L. Wright
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Citations (206)
System-on-package (SOP) technology, characterization and applications
2006
ECTC | Electronic Components and Technology Conference
John U. Knickerbocker
Paul S. Andry
Leena Paivikki Buchwalter
Evan G. Colgan
John M. Cotte
Hua Gan
Raymond Robert Horton
Sri M. Sri-Jayantha
John Harold Magerlein
Dennis G. Manzer
Gerard McVicker
Chirag S. Patel
Robert J. Polastre
E.S. Sprogis
Cornelia K. Tsang
B.C. Webb
S.L. Wright
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Citations (25)
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