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Yann Civale
Yann Civale
Dow Corning
Anodic bonding
Materials science
Composite material
Adhesive
Adhesive bonding
3
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Temporary Bonding Cost Of Ownership: The link between low total thickness variation and chip yield
2014
Thomas Uhrmann
Jürgen Burggraf
Harald Wiesbauer
Julian Bravin
Thorsten Matthias
Markus Wimplinger
Paul Lindner
H. Meynen
Yann Civale
Ranjith Samuel John
Sheng Wang
Peng-Fei Fu
Craig Rollin Yeakle
Gary Aw
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An innovative and low cost Bi-layer method for temporary bonding
2013
EPTC | Electronics Packaging Technology Conference
Jürgen Burggraf
Harald Wiesbauer
Julian Bravin
Thomas Uhrmann
H. Meynen
Yann Civale
Ranjith Samuel John
Sheng Wang
Peng-Fei Fu
Craig Rollin Yeakle
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Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits
2013
DIC | IEEE International D Systems Integration Conference
Yann Civale
H. Meynen
Ranjith Samuel John
Peng-Fei Fu
Craig Rollin Yeakle
Sheng Wang
Stefan Krausse
Thomas Rapps
Stefan Lutter
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