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Pin-Zhong Shen

National Taiwan University of Science and Technology

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Considerations of Dielectric Property Deviation and Mechanical Limitations for Antenna-in-Package Fabrication by SiP-based Stacked Organic Dielectric Substrates at Millimeter-wave Frequencies

2021 IEEE Transactions on Antennas and Propagation
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5G Antenna in Module (AiM) Architecture to Realize a Large Active Antenna Array with Unequal Shortest Microstrip Paths to Minimize Feeding Loss by Using True-delay Line-based Phase Shifters at Millimeter-Wave Frequencies

2021 ECTC | Electronic Components and Technology Conference
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Sensitivity of Dielectric Substrate Property Discrepancy and Metal Microstrip Roughness to the Electronic Characteristics of Antenna-in-Packaging for 5G Applications at Millimeter-Wave Frequencies

2021 ECTC | Electronic Components and Technology Conference
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