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Goh Mei Li
Goh Mei Li
Materials science
Electronic engineering
Automotive engineering
Standards organization
Chip-scale package
1
Papers
5
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A fresh look at thermal resistance in electronic packages
2000
EPTC | Electronics Packaging Technology Conference
Teoh King Long
Goh Mei Li
K.N. Seetharamu
Ahmad Yusoff Hassan
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Citations (5)
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