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F. Bechtold
F. Bechtold
Electronic engineering
Engineering
Polymer
Ceramic
Dielectric
3
Papers
5
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0
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Acoustic wave sensing devices and their LTCC packaging
2014
CAS | International Semiconductor Conference
Ioana Giangu
Valentin Buiculescu
G. Konstantinidis
Konrad Szaciłowski
Alexandra Stefanescu
F. Bechtold
Kacper Pilarczyk
A. Stavrinidis
Przemysław Kwolek
G. Stavrinidis
Justyna Mech
A. Muller
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Combination of MCM-C technology with MCM-D technology using photosensitive polymers
1998
APMPPI | International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces
M. Topper
K. Scherpinski
Robert Hahn
O. Ehrmann
Herbert Reichl
C. Schmaus
F. Bechtold
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Hybridintegration chemischer Mehrfachsensoren in Dickschichttechnik/ Hybrid integrated chemical multi-element sensors in thick-film technology
1989
Tm-technisches Messen
F. Bechtold
W. Pfab
P.G. Fenzlein
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