Fabrication of Flexible Pyramid Array as SERS Substrate for Direct Sampling and Reproducible Detection
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Rapid extraction and analysis of target molecules from irregular surfaces are in high demand in the field of on-site analysis. Herein, a flexible platform used for surface-enhanced Raman scattering (SERS) based on an ordered polymer pyramid structure with half-imbedded silver nanoparticles (AgNPs) was prepared to address this issue. The fabrication includes the following steps: (1) creating inverted pyramid arrays in silicon substrate, (2) preparing a layer of AgNPs on the surface of the inverted pyramids, and (3) obtaining a substrate with an ordered polymer pyramids array with half-imbedded AgNPs by the molding method. This flexible substrate is capable of rapid extraction via a simple and convenient "paste and peel off" method. In addition, the substrate exhibits great repeatability and good sensitivity thanks to the uniformity and larger surface area of the ordered pyramids. The density of "hot spots" (local electromagnetic field with high intensity) is increased on the structured surface. Semi-imbedding silver particles in the polymer pyramids makes "hot spots" robust on the substrate. In addition, the preprepared silicon template with the inverted pyramids can be reused, which greatly reduces the production cost. With this substrate, we successfully analyzed thiram molecules on the epidermis of apples, cucumbers, and oranges, and the detection limits are 2.4, 3, and 3 ng/cm2, respectively. These results demonstrate the great potential of the substrate for in situ analysis, which can provide reference for the design of ideal SERS substrates.A novel trans-scale bimetallic synergistic enhanced Raman scattering (TBSERS) substrate was fabricated and employed for sensitive detection of bisphenol A (BPA).
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Microstructures on a dummy substrate are bonded and transferred to the main substrate in a transfer process. The novel transfer process is developed using a new release layer on the dummy substrate. The release layer consists of a TiO2 layer and a poly(methyl methacrylate) (PMMA) film. Although the dummy substrate sticks to the main substrate after the bonding, the dummy substrate can be separated from the main substrate without using a pulling force by the UV exposure of the release layer. The force-free release can be obtained by PMMA film degradation by UV exposure. A cantilever with long beams (up to 1000 µm) and a wide base (5×3 mm2) is successfully fabricated by the new transfer process.
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Fabrication of silicon tip is described.Then the ap pl ication of silicon tip in sensor technology is summarized.The method of fabricat ion of silicon tip is compatible with modern IC processing,in addition to the si licon tip can be easy to sharp,it is practical than other materials.It is believ ed that the application of silicon tip would be developed with the improvement o f fabrication technology and other correlation technology.
Hybrid silicon laser
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A self-aligning etch method for silicon substrates is presented. A hole pattern is defined on the front side of the silicon substrate while etching of the hole takes place from the back side through the application of a current from the front side of the silicon substrate to a cathode electrode in a solution of HF, HNO3, and H2O. As the etching proceeds, the etched pattern in the back side gradually becomes self-aligned with the front side pattern of the silicon substrate. Twenty five circular holes arranged in a 5×5 array are formed in a boron-doped (100) silicon substrate. The etch method provides control over hole dimensions which are 520 μm in diameter and spaced 520 μm apart. The self-aligning property of the etch method enables the formation of different shaped holes.
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A new technique to form empty spaces in silicon substrates is presented. The empty space with various shapes, such as plate as well as sphere and pipe, could be formed under the surface of the silicon substrate.
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The functionalized MWNT-COOH and MWNT-NH2 were synthesized via acidification and amination reaction,and then the MWNT films were self-assembled on a PTFE substrate layer-by-layer(LBL).With the assistant of PDDA,it was easier to self-assembly of the MWNTs on the substrate.With the increasing layer numbers of MWNTs,the quality and topography of the surface of the MWNTs films were much more uniform and the conductance of the PFFE substrate can be obviously improved.
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Low cost electrochemical etching method was utilized to prepare macroporous silicon on p-type silicon substrate in dilute HF solution. By optimizing the substrate resistivity, the etching current density, and the etching time, excellent macroporous silicon was obtained on 15 Ω•cm p-type silicon substrate with the pore diameter of about 2 μm, the pore depth of about 30 μm, and the surface pore density up to ~107/cm2. Such macroporous silicon gave out an excellent antireflective performance with the reflectance lower than 4% in a wide spectral range of 400-1000 nm. The low reflectance combined with the deep pore morphology provides an attractive potential to fabricate radial p-n junction solar cells on such macroporous silicon.
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Using a vacuum of about 10 -6 mm, single crystal silicon films have been evaporated onto a silicon substrate. Source and substrate temperatures and the rate of deposition are critical parameters in attaining epitaxy with the substrate. Where the source silicon is heated in a crucible, the crucible material is important. Physical imperfections, doping and electrical characteristics of the films are discussed, together with devices made from them.
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