A Novel Strategy for Detecting Permittivity and Loss Tangent of Low-Loss Materials Based on Cylindrical Resonant Cavity
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Accurate measurement of the permittivity and loss tangent of low-loss materials is essential due to their special applications in the field of ultra large scale integrated circuits and microwave devices. In this study, we developed a novel strategy that can accurately detect the permittivity and loss tangent of low-loss materials based on a cylindrical resonant cavity supporting the TE111 mode in X band (8–12 GHz). Based on an electromagnetic field simulation calculation of the cylindrical resonator, permittivity is precisely retrieved by exploring and analyzing the perturbation of the coupling hole and sample size on the cutoff wavenumber. A more precise approach to measuring the loss tangent of samples with various thicknesses has been proposed. The test results of the standard samples verify that this method can accurately measure the dielectric properties of samples that have smaller sizes than the high Q cylindrical cavity method.Keywords:
Dissipation factor
Dielectric loss
Microwave cavity
In this paper, two important dielectric properties, the relative permittivity and the loss tangent of a new commercially available UV-curable SLA resin sample are determined. The characterization of the dielectric material is performed in the millimetre-wave range using an open-cavity Fabry-Pérot resonator. According to the manufacturer's data sheet, this ultra low-loss photoresist material, optimised for advanced electronic applications, has a relative permittivity of 2.6 and a loss tangent of 0.003, both at 10 GHz. First, the accuracy of the Fabry-Pérot open-cavity resonator was determined using a reference material called Rexolite. Then, the new dielectric material was measured in a frequency band from 60 GHz to 90 GHz. The results show that the new commercial resin sample has a relative permittivity of 2.59 and a loss tangent of 0.0031 at 71.8 GHz.
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Dielectric loss
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This paper presents a simple and low cost method to estimate relative permittivity and tangent loss for dielectric sheets used in printed circuit boards (PCB's). The process starts by building a rectangular cavity in a very easy manner. As an example, the results to estimate relative permittivity and tangent loss of a fiber glass PCB are shown. The relative permittivity and tangent loss are presented as a function of frequency. To obtain resonant frequencies, the return loss (S 11 ) was measured using a vector network analyzer (VNA). Relative permittivity and tangent loss were estimated at the frequencies of the excited modes in the resonant cavity. The results are presented in a frequency span of 1 GHz to 11 GHz. The nonlinear behavior of the relative permittivity and tangent loss for the dielectric material evaluated are presented. The relative permittivity exhibites a stable behavior at high frequencies while the tangent loss is shown to increase with frequency.
Dissipation factor
Dielectric loss
Return loss
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It was observed that changes in the environmental conditions have direct effect on the electrical parameters. High relative humidity increased the loss tangent. However, keeping the relative humidity constant while decreasing temperature, it was observed to decrease the loss tangent. It seems that the amount of water in the air controls the loss tangent; Decrease in temperature with constant relative humidity condenses some of the water vapor and thus the amount of water in the air is decreased. It was noticed that relative air humidity has a strong influence on permittivity. Increase in relative humidity was seen as an increase in permittivity and vice versa. Additionally, the temperature change affected the absolute value of permittivity. At lower temperatures the permittivity had lower values than at higher temperatures when the relative humidity remained fixed. Here, the absolute amount of water in the air seemed to be connected to this behavior as well.
Dissipation factor
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At frequencies of about 10 GHz, the complex relative permittivity of liquids of low loss is determined by an automatic precision method based on the computer-controlled measurement of the microwave power at the lower exit of a liquid-filled, inclined, standard waveguide and on a computer curve-fitting procedure. For the real part of the permittivity, a relative uncertainty of ±0.0007 is achieved. For the loss tangent, the uncertainty is |δtan Δ| ≦ 11 × 10-6.
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Dielectric loss
Waveguide
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This paper discusses the measurement accuracy of the loss tangent and the relative permittivity of low loss dielectrics. Typically used the 3 dB method combined with the Insertion Loss computations has been compared with the more precise Transmission Mode QFactor Technique for measurements of tan of Rexolite, Polyethylene, LSAT, CaF₂, Teflon, YVO₄ and SLAO at room temperature. Also for teflon, rexolite and polyethylene we conducted the comparison for temperatures from 24K to 84K. For teflon (with tan below 6·10₋₆) errors up to 100% have been obtained; but for dielectric with tan above 5·10₋₅, errors were below 5%. For ∑(r) measurements, errors introduced by the thermal expansion coefficient have been analysed and found to be between 2.4% and 3.5%.
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Dielectric loss
Transmission loss
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The dielectric studies of semi-crystalline Nylon 11 filled with a conducting polymer (PANI) were investigated in a wide range of frequency and temperature by using Impedance Analyzer. The main focus was on the effects of conducting filler content on dielectric properties of Nylon 11. The prominent factors such as dielectric permittivity, loss factor, and loss tangent were studied at high frequency. Two different concentrations (1 % and 5 % w/w) of the conducting filler were used. It was observed that with the increase of fillers concentration, the value of dielectric permittivity (ε’)б The dissipation factor (ε’’) and loss (tan ) decrease compared to pure Nylon 11.
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Loss factor
Dielectric loss
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Nylon 6
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A calorimetric technique was used to accurately determine the dielectric loss tangent of both additive−free and commerical grades of polyethylene at liquid−helium temperature. We found that the loss tangent of polyethylene often exhibits a broadened dielectric relaxation peak. Although this peak is centered in the kilohertz region, its existence increases the loss tangent at 60 Hz. Thus, the possibility of the elimination or reduction of this peak is important in evaluating the suitability of polyethylene as an insulator for a superconducting ac power transmission line. We have measured the intrinsic dielectric loss tangent of polyethylne and have found it to be ∼5×10−6. In addition, by systematically studying the influence of chemical additives on the dielectric loss, we have found the conditions necessary to obtain polyethylene exhibiting this low loss using present industrial production methods.
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Dielectric loss
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We provide an overview of two nondestructive techniques, the split-post and split-cylinder resonator, which are under consideration as standard test methods for measuring the relative permittivity and loss tangent of bare low-temperature cofired ceramic (LTCC) substrates over the frequency range of 1–30 GHz. The capabilities and limitations of the split-post and split-cylinder resonator are outlined, and the level of agreement between the two techniques is examined through comparison of the relative permittivity and loss tangent measurements of a fused silica and an LTCC substrate.
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To ensure high signal quality when operating in the high-frequency range, transmission losses must be reduced, and a low dielectric loss tangent is required for the insulating materials in printed wiring boards (PWBs). The dissipation factor of PWB materials for use in 5G base stations is at the 0.002-0.005 level, but post-5G and 6G equipment will require factors of 0.002 or even 0.001 or less. Olefins and other materials are being considered for use as next-generation low dielectric constant materials, but there is a trade-off between a low dielectric loss tangent and flame resistance for these materials, and no material that combines both properties has been reported to date. In this work, we have developed a novel material that offers both a low dielectric loss tangent and high flame retardance. This material has a dielectric loss tangent of less than 0.001, which is very low when compared with the PPE-based materials currently in use. Furthermore, the chemical structure has been optimized to provide flame resistance equivalent to that of the UL-94 V-0 standard. In addition, it also has thermosetting properties and a high glass transition temperature, which are required for PWB materials, and is expected to be a next-generation low dielectric loss tangent material.
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Thermosetting polymer
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Bi 1.5 Zn 1.0 Nb 1.5 O 7 ∕ Ba 0.6 Sr 0.4 Ti O 3 ∕ Bi 1.5 Zn 1.0 Nb 1.5 O 7 (BZN/BST/BZN) sandwich films were deposited by radio frequency magnetron sputtering. The relative permittivity and dielectric loss of the sandwich films were measured using planar Pt∕BZN∕BST∕BZN∕Pt∕Ti∕SiO2∕Si capacitor structures. The sandwich films with thickness of about 280nm exhibited relative permittivity around 206–247 and dielectric loss tangent (tanδ) less than 0.008 at 1MHz. Films annealed at 750°C had an ∼11% relative tunability of the permittivity at a maximum applied bias field of 0.77MV∕cm. The sandwich films are not ferroelectric at room temperature.
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Dielectric loss
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