Study on Solvent Debinding Process of Powder Injection Molded Ti(C, N)-Based Cermets
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When WC and group Ⅳ elements are added to Ti(C,N)-Ni cermet, microstructures of the cermet is changed. The change effects directly on the property of the material. In this study, the amount of WC and group Ⅳ elements of Ti(C,N) cermet tool was investigated. The composition of WC was changed from 5 to 20wt% to determine the effect of WC on the cutting performance of cermet tool. The more WC was added. the longer the tool life of the cermet tool was. The cermet with I wt% ZrC and 14wt% WC showed the best cutting performance among the investigated cermet tools. The cutting performance of cermet cutting tools suggests the possibility in interrupted cutting for reliability test, experimentation was performed repeatedly with Ti(C_0.7,N_0.3)-14WC-1ZrC-20Ni cermet tool machining SCM440. The flank wear of cermet cutting tool at given time condition is suitable for Normal distribution and Log normal distribution by Chi squared test.
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Ti(C,N)-based cermet was fabricated by spark plasma sintering(SPS) technology. The formation of Ti(C,N) phase was analyzed by XRD. The microstructure of cermet prepared was observed by SEM. The hardness, bending strength and porosity of the cermet were also measured. Cermet prepared by the process at (1 350℃) for 8min duration had best performance. The effect of grain growth inhibitor VC on the properties of the cermet was also investigated. Cermet prepared with VC additive had finer microstructure but higher porosity, however, the performance of the cermet with VC was better than that without VC (additive.)
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xNi/(10NiO-NiFe2O4) cermet, xCu/(10NiO-NiFe2O4) cermet and x(20Ni-Cu)/(10NiO-NiFe2O4) cermet (x=5,10,17) were prepared for aluminum electro-winning and their corrosion resistance into a classical electrolyte was studied in laboratory electrolysis. The results show that preferential corrosion of Ni metal was observed and electrolytes are penetrated into the anode during electrolysis. Nevertheless, this corrosion mechanism was not necessary observed in the cases of xCu/(10NiO-NiFe2O4) cermet and x(20Ni-Cu)/(10NiO-NiFe2O4) cermet. Moreover, the thickness of the depleted metal zone of cermet inert anode with 20Ni-Cu is thinner than that of Ni and Cu (x=5,10,17).According to Gibbs free energy change and wear rate calculations, the corrosion resistance of x(20Ni-Cu)/(10NiO-NiFe2O4) cermet is better than that of xCu/(10NiO-NiFe2O4) cermet and xNi/(10NiO-NiFe2O4) cermet. Because of the higher electrical conductivity and the better wettability with ceramic matrix, we observed that nickel addition improves relative density of x(20Ni-Cu)/(10NiO-NiFe2O4) cermet and copper enhances the electrical conductivity of x(20Ni-Cu)/(10NiO-NiFe2O4) cermet. Thus, the corrosion resistance of x(20Ni-Cu)/(10NiO-NiFe2O4) cermet was found better than both xCu/(10NiO-NiFe2O4) cermet and xNi/(10NiONiFe2O4) cermet
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Cutting performance for S48C of nitrogen-free TiC-10 vol%Mo2C-10 vol%Ni cermet (A-cermet) was mainly studied comparing with nitrogen contained TiC-20 vol%TiN-10 vol%Mo2C-10 vol%Ni cermet (B-cermet), in relation to their mechanical properties such as transverse-rupture strength, hardness from room temperature to 1000°C, creep resistance at 1050°C. Specimens having grain sizes of 2.5, 1.5 and 1.0 /μm were used in both cermets. It was found that, at low cutting speed (130 m/min), a coarse grained A-cermet was the most excellent in flank wear (VB) among both cermets with different grain size, and the VB value of A-cermet was always lower than B-cermet with the same grain size. On the other hand, at high cutting speed (250 m/min), VB of a fine grained A-cermet was excellent and nearly the same that of coarse grained B-cermet. As for the resistance to fracture, B-cermet seemed to be superior to A-cermet. A further study is needed to test whether the nitrogen contained cermet was really useful for cutting tool materials or not.
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New cermet film structures suitable for selective solar absorbers, composed of two cermet sublayers with identical metal volume fractions in each sublayer, on metal reflectors with an antireflection dielectric layer coating are described. The absorbing cermet sublayers have thickness and volume fractions such that solar radiation is absorbed internally and by phase cancellation interference. They are substantially transparent in the thermal infrared region. Modeling of the new cermet layer structures has revealed a number of different selective surfaces, involving a variety of practical cermet materials, with better performance than recent published results. For example, the best predicted ratio of absorptance to normal emittance α/ε at room temperature is 46 for a Cu-SiO2 cermet, 49 for a Cu-Al2O3 cermet and a Au-Al2O3 cermet. The best laboratory results of α/ε at room temperature thus far are 46 for a Cu-SiO2 cermet, and 45 for a Au-Al2O3 cermet. From computer modeling, using published experimental dielectric functions of a Co-Al2O3 cermet, absorptance of 0.93 and normal emittance of 0.026 at 50 °C (α/ε=36) could be obtained for a two-cermet-sublayer film on a Mo reflector with an Al2O3 antireflection layer.
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When WC and group Ⅳ elements are added to Ti(C,N)-Ni cermet, microstructures of the cermet is changed. The change effects directly on the property of the material. In this study, the amount of WC and group Ⅳ elements of Ti(C,N) cermet tool was investigated. The composition of WC was changed from 5 to 20wt% to determine the effect of WC on the cutting performance of cermet tool. The more WC was added. the longer the tool life of the cermet tool was. The cermet with I wt% ZrC and 14wt% WC showed the best cutting performance among the investigated cermet tools. The cutting performance of cermet cutting tools suggests the possibility in interrupted cutting for reliability test, experimentation was performed repeatedly with Ti(C_0.7,N_0.3)-14WC-1ZrC-20Ni cermet tool machining SCM440. The flank wear of cermet cutting tool at given time condition is suitable for Normal distribution and Log normal distribution by Chi squared test.
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