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    Nanosecond Nd:YAG laser induced backside wet etching of NaCl with eutectic gallium-indium alloy as absorbing liquid
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    By employing rapid solidification and powder metallurgy technique, a new hypereutectic aluminum silicon alloy material was fabricated. The cold compact billets were canned then hot extruded. Microstructure and properties of the material were investigated. Experimental results have shown that compared to the cast alloy, the strength and plasticity was obviously improved, and the primary silicon crystal was fined and evenly distributed in aluminum matrix.
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    The goal of the present work is to investigate the effects of the addition of Sb (0, 3 and 6 wt%) on structure, melting, corrosion and mechanical properties of Sn-Bi eutectic solder alloys. The mechanical properties of the bulk Sn-Bi-Sb solders were higher as the amount of antimony increases, making compressive strength augment from 65 MPa to 100 MPa when 6 wt% Sb was incorporated to the Sn-Bi eutectic alloy. The three alloys presented a melting temperature that is smaller to the one exhibited by the eutectic alloy Sn-38Pb (Tm = 183°C). According to the electrochemical results, the addition of higher contents of Sb to the Sn-Bi eutectic alloy had a positive effect: it ennobled the Ecorr values.
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    This report is the MS thesis of Xiangyu Yin, defended May 9, 2011. The research described herein was supported in part by the National Science Foundation under grant DMR 09-04096 (Metals Program).
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