Photovoltaic properties of F:SnO2/CdS/CuO/Ag heterojunction solar cell
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Field emission microscopy
Nanoscale silver functional coatings were prepared on the surface of nanofiber at room temperature by DC reactive magnetron sputtering process. The surface morphology and microstructure of silver coatings prepared by using different sputtering powers were characterized by scanning electron microscopy( SEM) and transmission electron microscopy( TEM),along with their transmisivity. X-ray diffractometry was used to examine the crystalline state of the silver coatings. The results showed that silver coatings were formed by small-sized and homogeneous particles. Increasing the sputtering power increased the size of silver particles,and accordingly increased the evenness and compactness of the coatings. The as-prepared silver coatings presented a face-centered cubic of polycrystalline structure,and with the increase of sputtering power,the crystallinty and UPF of the coatings enhanced significantly.
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Nickel (Ni) film electrodes were deposited onto FTO by the magnetron sputtering method. The influence of sputtering power on the morphology and electrochemical performances of the asâ€prepared films has been investigated in this work. The surface crystal structure and morphology of the prepared films were investigated by using Xâ€ray diffraction (XRD) and scanning electron microscope (SEM). The results have shown that with the increase of the sputtering power from 80 W to 140 W, the increases of the film surface roughness and porosity. The films deposited at sputtering power of 140 W possess the highest specific surface area and abundant pore structure, leading to better electrochemical performance of Ni film.
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It is widely accepted that thin conducting films of noble metals have the desirable properties of high electron emission and high resistance to corrosion which fit them for use as specimen coatings for scanning electron microscopy. However, although Au and its alloys with Pd are regularly used for this purpose, deposited by either evaporation or sputtering, the use of Pt has apparently been ignored. The high evaporation temperature of this metal (2090°C against 1350°C for Au) makes its controlled evaporation inconvenient, but the recent commercial introduction of simple sputter coaters, coupled with developments in Pt plating technology, have made the sputtering of Pt on to SEM specimens a practical proposition. A comparison of the properties of sputtered coatings of Au and Pt has therefore been made; results given below show that satisfactory coatings may be made with Pt as conveniently as with Au, and that in some respects the Pt coatings are superior.
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The La–Sr–Mn–O thin films were deposited on Si(100) substrate by DC magnetron sputtering with different O2/(O2+Ar) ratio. The effect of O2/(O2+Ar) ratio on the deposition rate of the films was studied using SEM (scanning electron microscopy) analysis. The results showed that the film thickness was homogeneous and the O2/(O2+Ar) ratio displayed an important effect on deposition rate. The deposition rate of films grown at higher substrate temperature and sputtering pressure decreased in parabolic relation with the increasing of O2/(O2+Ar) ratio. It decreased 52.8% when O2/(O2+Ar) ratio increased from 4.4% to 45.6%. The deposition rate of films grown at lower substrate temperature and sputtering pressure decreased in exponential relation with the increase of O2/(O2+Ar) ratio. The increase of oxygen content increased the collision probability between oxygen atoms/ions and sputtered atoms/ions, which decreased the kinetic energy of sputtered atoms/ions. Then the number of sputtered atoms/ions arriving at substrate decreased, which resulted in the reduction of deposition rate.
Deposition
Cavity magnetron
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Emission intensity
Intensity
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Smooth and small grain size copper films are essential for their application.Using D.C.magnetron sputtering,copper films were deposited on glass substrate.The purity of copper target is above 99.9%.During the experiment,workingpressure was kept at 2.7 Pa.The texture,grain size and surface topography of copper films were studied by X-ray diffraction(XRD) and scanning electron microscopy(SEM).The results indicate that the grain size is increased with the increase in sputtering power and time.The XRD results indicate that the texture of films is reduced with the increase in sputtering power.The SEM results show that the copper films have flaws when the sputtering power is under 100 W.Simultaneously,the SEM results also indicate that the surface of films are smooth and tight when the sputtering power is 150 W,but the grains size is larger,which is expected to reduce further.
Texture (cosmology)
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Abstract The sputter deposition of stoichiometric TiO 2 thin films has been investigated, in view of photocatalytic application. DC magnetron sputtering from ceramic targets in an argon/oxygen atmosphere was chosen as the deposition technique. Composite TiO 2 Ti targets with metallic Ti fraction from 0 to 70 wt% were prepared from TiO 2 and Ti powders following a standard ceramic procedure. The influence of target composition and sputter parameters on the film composition was examined by means of optical transmission measurements, XRD and XPS. From the former, optical absorption coefficients are calculated, which are used as a measure for the films' stoichiometry. Curve fitting of the Ti 2p 3/2 photoemission line yields the composition in terms of the presence of reduced species. Upon sputtering in argon, translucent layers are obtained for targets with up to 35 wt% Ti. For higher amounts, the optical absorption coefficient α at 550 nm increases and the layers become dark. With increasing metal Ti contribution and argon flow, more reduced Ti species contribute to the Ti 2p photoemission line. In reactive sputter mode, near‐stoichiometric TiO 2− x films are obtained for low oxygen mole fractions. For higher oxygen contributions, reduced Ti species are increasingly present for all targets. This reduction is ascribed to active re‐sputtering of the deposited layer by O − ions and the sputter yield difference between oxygen and titanium. Copyright © 2004 John Wiley & Sons, Ltd.
Stoichiometry
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A new deposition technique involving the dc magnetron sputtering of Fe simultaneously with Ga evaporation has been developed to fabricate thin Fe(1−x)Gax (0<x<0.4) films. Simultaneous sputtering and evaporation has been developed as an alternative to the sputtering of alloy targets, where the need for compositional variation can be hard to address. The new technique allows the freedom of composition that cosputtering would offer, but mitigates the issue of being unable to sputter Ga. The need for the preparation of alloy targets is also avoided. To control the concentration of the Ga in the films, the evaporation rate, the dc magnetron power, and the chamber pressure were varied. The films fabricated were studied to determine their magnetic and microstructural properties. The Fe–Ga films fabricated had magnetostriction constants which had increased by a factor of 5 compared to the same thickness of Fe film.
Deposition
Cavity magnetron
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Abstract In this paper we report a new method for Cu(In,Ga)Se 2 deposition for solar cell application. Differently from the common co‐evaporation process, an alterative approach for thin film Cu(In,Ga)Se 2 has been tested: the sputtering deposition of metal elements combined with the selenium evaporation. We have studied the relationships between the growth parameters of our hybrid sputtering/evaporation method and the chemical‐physical properties of the CIGS films. The cells are completed with a CdS buffer layer deposited by chemical bath deposition and ZnO + ITO deposited by RF sputtering. Test solar cells of 0.5 cm 2 have shown an efficiency of 10% and 2.5% on glass and stainless steel substrate respectively. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
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Mo films were deposited on the substrates of stainless steel by DC magnetron sputtering method.Mo films were characterized by X-ray diffraction(XRD),scanning electron microscopy(SEM),and FT-IR Spectrometer.The influence of sputtering pressure and sputtering power on the microstructure,morphology and the infrared reflectivity were studied.
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