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    In-situ measurement of Ti-6Al-4V grain size distribution using laser-ultrasonic technique
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    Transmission-EBSD (t-EBSD) method is proposed as a new method for nano-scale microstructures analysis of materials. t-EBSD uses TEM thin foil specimen. Electrons transmitted through the specimen form EBSD patterns. A EBSD detector used for standard EBSD (s-EBSD) is used to acquire these t-EBSD patterns. The patterns are indexed in the same manner as s-EBSD to get crystal orientation. The conditions to get good t-EBSD patterns, formation of t-EBSD patterns and spatial resolution of this method are studied in this paper. Specimen thickness affects seriously to the results of orientation mapping by t-EBSD. It is confirmed that t-EBSD patterns are formed at the bottom layer of the specimen. If the specimen is very thin, the patterns become very weak and noisy. If the specimen becomes thicker, t-EBSD patterns lose its contrast and sometimes patterns become weak with reverse contrast bands. This means that total thickness of the specimen is important for t-EBSD method, but overlapped grains look not so big problem to get t-EBSD patterns. Electron beam spread in the specimen is reduced due to thin foil specimen, and it improves spatial resolution of EBSD orientation map. It is confirmed that it can achieve about 10 nm spatial resolution and about 30 nm size grains can be detected with reasonable thickness specimen.
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    Grain boundary character distribution(GBCD) and connectivity in the recrystallized IF steel sheets which cold-rolled by different reductions were investigated by electron back-scatter diffraction(EBSD).The results show that higher cold reduction is favorable for increasing the frequency of low-angle boundaries(∑1).While higher frequency of low-energy special boundaries(∑1~∑29) are favorable for the optimization of grain boundary connectivity.It has also been found that GBCD and connectivity of IF steels are closely related to the grain size.The small grains are mainly surrounded by special boundaries while the large grains are preferentially surrounded by random boundaries.
    Grain boundary strengthening
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    The mechanism and the basic principle of electron backscatter diffraction(EBSD) were introduced briefly.The several crystal materials were analyzed by use EBSD method in substance appraise,crystal orientation,grain size,crystal boundry distribution and material failure mechanism.The results showed that EBSD technique was a good method to detect the microscopic structure of crystal materials.
    Crystal (programming language)
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    AbstractThis review documents the application of electron backscatter diffraction (EBSD) in a scanning electron microscope to studies of grain boundaries. The EBSD technique is now applied routinely for the rapid measurement of crystallographic orientations, generally known as 'microtexture', in a variety of materials. Processing methodology and interpretation of EBSD data for interface studies require a different approach and different nomenclature to those for microtexture. After covering briefly the general principles of EBSD, this review therefore describes in detail EBSD data acquisition relevant to grain boundary characterisation, descriptions of interfaces, and both standard and advanced EBSD data processing. The approach taken is to highlight and explain the principles, issues, and pitfalls associated with the application of EBSD to grain boundaries. Finally, some suggestions are made for good practice in application of EBSD to grain boundaries.Keywords: ELECTRON BACKSCATTER DIFFRACTIONGRAIN BOUNDARY CHARACTERISATIONCOINCIDENCE SITE LATTICECRYSTALLOGRAPHIC ORIENTATIONMISORIENTATION
    Backscatter (email)
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    A novel evaluation method of the crystallinity of grain boundaries was proposed by analyzing the quality of Kikuchi lines obtained from the conventional EBSD (Electron Backscatter Diffraction) analysis. This method can evaluate the porous and brittle grain boundaries by using the IQ (Image Quality) values and the CI (Confidence Index) values. Both the IQ and CI values are the parameters which are obtained from the observed Kikuchi pattern obtained from the area where electron beams penetrate during EBSD analysis. The position of the grain boundaries is determined by this CI value, and the crystallinity of the film around grain boundaries is evaluated by the IQ value quantitatively. By using this method, the grain boundary degradation of the electroplated copper thin-film interconnection due to SM (Stress-induced Migration) was evaluated quantitatively and the effectiveness of the concept of grain boundaries based on the ordering quality of atomic arrangement which is different from the conventional one based on the crystal orientation has been shown.
    The electron backscatter diffraction (EBSD) technique has proven to be very useful in the measurement of crystallographic textures, orientation relationships between phases, and both plastic and elastic strains. This article focuses on backscatter diffraction in a scanning electron microscope and describes transmission Kikuchi diffraction. It begins with a discussion on the origins of EBSD and the collection of EBSD patterns. This is followed by sections providing information on EBSD spatial resolution and system operation of EBSD. Various factors pertinent to perform an EBSD experiment are then covered. The article further describes the processes involved in sample preparation that are critical to the success or usefulness of an EBSD experiment. It also discusses the applications of EBSD to bulk samples and the development of EBSD indexing methods.
    Selected area diffraction
    Kikuchi line
    Abstract Since the automation of the electron backscatter diffraction (EBSD) technique, EBSD systems have become commonplace in microscopy facilities within materials science and geology research laboratories around the world. The acceptance of the technique is primarily due to the capability of EBSD to aid the research scientist in understanding the crystallographic aspects of microstructure. There has been considerable interest in using EBSD to quantify strain at the submicron scale. To apply EBSD to the characterization of strain, it is important to understand what is practically possible and the underlying assumptions and limitations. This work reviews the current state of technology in terms of strain analysis using EBSD. First, the effects of both elastic and plastic strain on individual EBSD patterns will be considered. Second, the use of EBSD maps for characterizing plastic strain will be explored. Both the potential of the technique and its limitations will be discussed along with the sensitivity of various calculation and mapping parameters.
    Characterization
    Strain (injury)
    Backscatter (email)
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