Superior dielectric properties in Na0.35%Ba99.65%Ti99.65%Nb0.35%O3/PVDF composites
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Keywords:
Dissipation factor
Polyvinylidene fluoride
Dielectric loss
Atmospheric temperature range
With the increasing speed of information and communication equipment in recent years, together with the high-speed signal processing of LSIs, there is a requirement for build-up electrical insulation materials (used in IC package substrates) to have low-dielectric loss tangent which reduces dielectric loss so as to achieve low transmission loss in the high-frequency GHz bands. At the same time, there is an increasing need for materials to have low-CTEs (Coefficient of Thermal Expansion) so as to ensure highly reliable substrates. With our formulation technology, we have developed a next-generation film-shaped build-up electrical insulation material compatible with high-frequency signal transmission by using a composition of practical thermosetting epoxy resin, which has realized both a low-dielectric loss tangent and at the same time, a low-CTE. In addition, this material can show a low-surface roughness after the film desmear process. It is thus expected to help reduce not only dielectric loss by means of a low- dielectric loss tangent, but also conductor loss caused by the skin effect, and will promote fine line formation by means of SAP (Semi Additive Process).
Dissipation factor
Dielectric loss
Thermosetting polymer
Transmission loss
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Dissipation factor
Dielectric loss
Figure of Merit
Loss factor
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The dielectric studies of semi-crystalline Nylon 11 filled with a conducting polymer (PANI) were investigated in a wide range of frequency and temperature by using Impedance Analyzer. The main focus was on the effects of conducting filler content on dielectric properties of Nylon 11. The prominent factors such as dielectric permittivity, loss factor, and loss tangent were studied at high frequency. Two different concentrations (1 % and 5 % w/w) of the conducting filler were used. It was observed that with the increase of fillers concentration, the value of dielectric permittivity (ε’)б The dissipation factor (ε’’) and loss (tan ) decrease compared to pure Nylon 11.
Dissipation factor
Loss factor
Dielectric loss
Filler (materials)
Nylon 6
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With the increasing speed of information and communication equipments in recent years, together with the high-speed signal processing of LSIs, there is a requirement for build-up electrical insulation materials (used in IC package substrates) to have low-dielectric loss tangent which reduces dielectric loss so as to achieve low transmission loss in the high-frequency GHz bands. At the same time, there is an increasing need for materials to have low-CTEs (Coefficient of Thermal Expansion) so as to ensure highly reliable substrates. With ou formulation technology, we have developed a next-generation film-shaped build-up electrical insulation material compatible with high-frequency signal transmission by using a composition of practical thermosetting epoxy resin, which has realized both a low-dielectric loss tangent and at the same time, a low-CTE. In addition, this material can show a low-surface roughness after the film desmear process. It is thus expected to help reduce not only dielectric loss by means of a low-dielectric loss tangent, but also conductor loss caused by the skin effect, and will promote fine line formation by means of SAP (Semi Additive Process).
Dissipation factor
Dielectric loss
Thermosetting polymer
Transmission loss
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A calorimetric technique was used to accurately determine the dielectric loss tangent of both additive−free and commerical grades of polyethylene at liquid−helium temperature. We found that the loss tangent of polyethylene often exhibits a broadened dielectric relaxation peak. Although this peak is centered in the kilohertz region, its existence increases the loss tangent at 60 Hz. Thus, the possibility of the elimination or reduction of this peak is important in evaluating the suitability of polyethylene as an insulator for a superconducting ac power transmission line. We have measured the intrinsic dielectric loss tangent of polyethylne and have found it to be ∼5×10−6. In addition, by systematically studying the influence of chemical additives on the dielectric loss, we have found the conditions necessary to obtain polyethylene exhibiting this low loss using present industrial production methods.
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Dielectric loss
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To ensure high signal quality when operating in the high-frequency range, transmission losses must be reduced, and a low dielectric loss tangent is required for the insulating materials in printed wiring boards (PWBs). The dissipation factor of PWB materials for use in 5G base stations is at the 0.002-0.005 level, but post-5G and 6G equipment will require factors of 0.002 or even 0.001 or less. Olefins and other materials are being considered for use as next-generation low dielectric constant materials, but there is a trade-off between a low dielectric loss tangent and flame resistance for these materials, and no material that combines both properties has been reported to date. In this work, we have developed a novel material that offers both a low dielectric loss tangent and high flame retardance. This material has a dielectric loss tangent of less than 0.001, which is very low when compared with the PPE-based materials currently in use. Furthermore, the chemical structure has been optimized to provide flame resistance equivalent to that of the UL-94 V-0 standard. In addition, it also has thermosetting properties and a high glass transition temperature, which are required for PWB materials, and is expected to be a next-generation low dielectric loss tangent material.
Dissipation factor
Dielectric loss
Thermosetting polymer
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Polyvinylidene fluoride
Dissipation factor
Dielectric loss
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A new kind of transformer oil-based nanofluids(NFs)with ZnO semiconducting nanoparticles is prepared to investigate the influences of adding nanoparticles on dielectric loss tangent of transformer oil.The mechanism on how the nanoparticle volumetric concentration and environmental temperature affect the NF dielectric loss tangent is also discussed.A new dielectric loss model based on conduction loss and nanoparticle relaxation loss is proposed. The experiments show that the ZnO NF dielectric loss tangent linearly increases with the nanoparticle volumetric concentration and exponentially increases with the temperature. Meanwhile the calculation of dielectric loss model coincides well with the experiments.The further analysis suggests that for ZnO NFs the dielectric loss tangent is dominantly determined by conduction loss,and the influence of nanoparticle relaxation loss is slight.
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Dielectric loss
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The paper reports permittivity and loss tangent measurements of LTCC materials in 90-140 GHz frequency band. The measurement technique is based on transmission through the dielectric sample in free space conditions. Both permittivity and loss tangent are determined as a function of frequency.
Dissipation factor
Dielectric loss
Extremely high frequency
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Systematic investigations on the dielectric properties of multi-walled carbon nanotubes (MWNTs)-polyvinylidene fluoride (PVDF) composites with a wide MWNT concentration range (2 - 9 wt%) have been carried out. It is revealed that the dielectric constant is increased by the addition of an appropriate amount of MWNTs at room temperature. However, when the concentration of MWNTs in the composites reaches above 5 wt%, negative dielectric constants and large dielectric loss in the composites are observed in the low frequency range. The ferroelectric CNT-PVDF polymer composites containing more than 5 wt% MWNTs have a strong dielectric absorption, which has the potential for acoustic applications.
Polyvinylidene fluoride
Dielectric loss
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