Thin concentrator photovoltaic module with micro-solar cells which are mounted by self-align method using surface tension of melted solder
Nobuhiko HayashiM. TerauchiYouichirou AyaShutetsu KanayamaHikaru NishitaniTohru NakagawaMichihiko Takase
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Abstract:
We are developing a thin and lightweight CPV module using small size lens system made from poly methyl methacrylate (PMMA) with a short focal length and micro-solar cells to decrease the transporting and the installing costs of CPV systems. In order to achieve high conversion efficiency in CPV modules using micro-solar cells, the micro-solar cells need to be mounted accurately to the irradiated region of the concentrated sunlight. In this study, we have successfully developed self-align method thanks to the surface tension of the melted solder even utilizing commercially available surface-mounting technology (SMT). Solar cells were self-aligned to the specified positions of the circuit board by this self-align method with accuracy within ±10 µm. We actually fabricated CPV modules using this self-align method and demonstrated high conversion efficiency of our CPV module.Keywords:
Concentrator
Soldering is used extensively in the electronic industry. It used to connect
printed circuit board to join the circuit between electronic parts. The quality and
reliability of electronic products strongly depend on those of solder joints. The
quality reliability of solder joint as the title of this project is to study about joint
solder of lead free solder (SnO.7Cu) and printed circuit board with various heat
treatments. The objectives of this project is to analyze the strength between solder
and printed circuit board by various heat treatment temperature besides investigate
whether the change of temperature treatment will affect the joint strength of solder
and printed circuit board. Tensile test is used in this project to analyze the reliability
of the solder joint. At the end of the project, the reliable and efficient temperature is
determined, 120°C at 1 hour heat treatment while unreliable temperature is 120°C at
2 hours of heat treatment.
Dip soldering
Solder paste
Circuit reliability
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Solder paste
Dip soldering
Surface-mount technology
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Efficiencies above 40% have been achieved with MJ solar cells. Looking at the fast development, it is concluded that it is very likely that the target of 50% will eventually be achieved. They will be cost effective only if they operate under highly concentrated (HC) sunlight. The manufacturing of a concentrator has to be addressed at three levels of integration: module, array and PV subfield. All these aspects, together with the cell and the concentrator optics will be considered in this article. We shall try to substantiate why we think that HC photovoltaics (HCPV) has chances to become the cheapest of the PV technologies and beat the prevalent electricity generation technologies. But the way will be paved of challenges and the success is not granted.
Concentrator
Sunlight
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Dip soldering
Reflow soldering
Ball grid array
Solder paste
Electronic component
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The paper is the result of thermovision experiments regarding the measurements of the temperature distribution on the surface of populated printed circuit board (PCB) in order to develop evaluation methods for solder joints quality as result of soldering process and for electronic modules "in circuit" functional tests. In the paper are presented and analyzed the methods emphasizing the differences between solder joints resulting from different soldering processes via analysis of their functional temperatures in the same electrical parameters of the measurement circuits.
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A high frequency PCB (printed circuit board) can not be coated with solder mask, because solder mask on a PCB, acting as a kind of dielectric, greatly affects the electronic characteristics of high frequency circuits. But, the soldering of SMD (surface mounted devices) on a PCB with no solder mask brings on many problems during assembly, such as lack of solder in solder joints, components soldered onto the PCB which are skew, are away from solder pads, or stand up like tombstones. Now, we can use a temporary solder mask to solve all these problems.
Dip soldering
Solder paste
Surface-mount technology
Electronic Packaging
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Transparent dye-sensitized solar cells (DSSCs) can be coupled within a building's architecture to provide daylighting and electrical power simultaneously. In this work, the relationship between the transparency and performance of DSSCs is studied by changing the TiO2 electrode thickness. The 10 µm thickness device shows a power conversion efficiency of 5.93% and a Jsc of 12.75 mA/cm2 with 37% transparency in the visible range. However, the performance loss in DSSCs during the scale up process is a potential drawback. This can be addressed using an optical concentrator with DSSC to generate more power from small size devices. Here, a compound parabolic concentrator (CPC) is coupled with DSSCs and its performance is compared to a scaled-up device (approx. 4 times). Furthermore, the impact of operating temperature on the performance of the bare and concentrator-coupled devices is discussed in this article. An increase of 67% in power conversion efficiency is observed at 36 °C for the concentrator-coupled device under 1000 W/m2 illumination. Maximum Jsc of 25.55 mA/cm2 is achieved at 40 °C for the concentrated coupled device compare with the Jsc of 13.06 mA/cm2 for the bare cell at the same temperature.
Concentrator
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The Knelson Concentrator is a verticle centrifugal concentrator which was developed by the Knelson Gold Concentrators Inc of Canada in 1980s Recently, the Knelson Concentrators have been extensively applied in gold ore processing in many countries This paper presents the basic construction and characteristics of some common models, including laboratory Knelson Concentrator, industrial manual discharge Knelson Concentrator, central discharge Knelson Concentrator and variable discharge Knelson Concentrator
Concentrator
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Introduce technology characteristic of lead-free wave soldering,and introduce each subsystem of lead-free wave soldering equipment according as technology process. Compare lead-free soldering to Sn-Pb soldering from solder wettability,solder oxidation and intermetallic component formation.Put forward attentive problems of lead-free soldering process and how to solve these.From technology of lead-free soldering, wave soldering process is a uniform system.Change of each parameter maybe affects solder joints performances.We should optimize wave soldering parameters for excellent solder joints.
Dip soldering
Lead (geology)
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