Deposition pattern and tracer particle motion of evaporating multi-component sessile droplets
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An integrated Eulerian model for fouling in turbulent flow was developed to simulate the particle fouling characteristics. The model comprises a deposition process and removal process. The deposition process considers four various factors affecting the particle deposition which are Brownian and eddy diffusion, gravity, thermophoretic, and turbophoretic forces. This study compares the Lagrangian and Eulerian approaches under the same operating conditions with an emphasis on their performance in predicting particle deposition. The deposition height calculated by using the Eulerian approach is in good agreement with the experimental data and the deposition morphology is similar to that observed in experiments. Furthermore, this paper explores the deposition characteristics and predicts the deposition morphology under different particle sizes.
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It is important but difficult to control the uniformity of solute deposition from a nanoliter droplet. The uniformity of solute deposition for a droplet in a nanoliter well is controlled by evaporation process. This paper proposes a method for uniform solute deposition from droplet evaporation confined by rib structures with specific surface properties, and the dynamic process is conducted experimentally and is analyzed in detail. Hydrophilic degree on the well surface is critical for controlling the film uniformity in the dynamic evaporation process, in particular around the rib of well. Experimental result indicates that the higher hydrophobicty (contact angle above 90°) on well surface yields flatter film profile during droplet evaporation inside a well, thus promotes a more uniform solute deposition.
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To study the deposition of particles on chip surface during the work of the thermal gas flow sensor, the paper analyzes deposition mechanism in depth by experiments to provide theoretical basis for reducing or avoiding particle deposition. The affecting factors of particle deposition such as electric field, the direction of sensor chip placement have been studied by monitoring the accuracy of flow sensor and the thickness of particle deposition on chip surface. The results show that the presence of electric field exacerbates the deposition of particles and the weight of particles has no significant effect on particle deposition.
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Particle deposition on film cooling surface is an engineering issue that degrades the thermal protection of turbine blade. Here, we present a combined experimental and numerical investigation on the particle deposition in the vicinity of multiple film cooling holes to reveal the effect of interactions between cooling outflows on particle deposition. The numerical simulation of film cooling with a group of three rows of straight film cooling holes is conducted and validated by experimental data with blowing ratios ranging from 0 to 0.08. Wax particles with size range from 5 to 40 μm are added in the heated mainstream to simulate the particle deposition in the experiment. The simulation results show the decrease of particle deposition with blowing ratio and various deposition characteristics in different regions of the surface. The flow fields from numerical results are analyzed in detail to illustrate deposition mechanism of the particles in different regions under the interactions of cooling outflows. The cooling air from the holes in the first row reduces the particle concentration near the wall but causes particle deposition in or between the tail regions by the generated flow disturbance. The cooling air from the latter hole separates the diluted flow in the upstream from the wall, and creates a tail region without particle deposition. This revealed particle deposition characteristics under the effect of outflows interaction can benefit the understanding of particle deposition in engineering applications, where multi-row of cooling holes are utilized.
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To predict particle deposition in axial compressor cascades, a new particle deposition was developed. Particle deposition was studied by partial deposition model and entireness deposition model. The calculation results showed the two models have large effect on the deposition at the leading edge. Using part deposition model, the phenomenon of a great deal of particle deposition at the leading edge during very short period disappeared while particle deposition appeared relatively even deposition.
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