Nanoscale Education for Semiconductor Design
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Over the last decades, nanotechnology had established itself as the upcoming revolution in science and technology. The ability of manipulating material at the atomic and molecular levels allowed nanotechnology to open an entirely new paradigm of devices and products. The worldwide market of products incorporating nanotechnology achieved $245 million in 2009 and estimated to reach $6 trillion by 2020. In the semiconductor industry several new nanodevices have been proposed to replace the classical CMOS devices that have been used over the last four decades. These new nanodevices have shown significant potential to overcome the fundamental limits of CMOS devices, and to advance the semiconductor industry further. However, limited educational resources and processes are available to prepare future nanotechnology engineers and scientists to integrate these promising nanodevices into the main semiconductor manufacturing streams. This paper proposes new learning structures and processes to propagate nanotechiology learning resources over the pervasive Web. The proposed approach is illustrated by a case study centered around the manufacturing of future nanodevices. We adopt standard structures and processes to organize and navigate through digital instructional contents, such as IEEE LOM and IMS LD. In doing so, we aim at streamlining the propagation of reusable repositories across the open Web to facilitate the integration of nanotechnology learning resources into the rising social trend of massively open online courses (or MOOCs)Keywords:
Semiconductor Industry
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Prosperity
Semiconductor Industry
Semiconductor device fabrication
Wafer fabrication
Manufacturing
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The demand for ESD control in the semiconductor industry has become more and more stringent especially from customers within the automotive industry segment. The requirement for an ESD capability analysis for the whole manufacturing process line is no longer an option. This paper provides an overview of an ESD capability/risk analysis in a semiconductor back end manufacturing process. The challenges encountered in the analysis and the solutions are provided.
Semiconductor device fabrication
Semiconductor Industry
Manufacturing process
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Extensive research into the treatment and control of Volatile Organic Compounds (VOCs) from semiconductor industry manufacturing processes has identified the need for alternatives to existing combustion devices. Specifically, semiconductor manufacturing design is moving toward the application of effective, small-scale, abatement control technologies for specific point-of-use (POU) waste streams associated with a particular component or manufacturing tool. The consortium of companies involved in semiconductor precompetitive research and development known collectively as SEMATECH recently evaluated eleven emerging environmental technologies designed to treat POU process emissions of VOCs specific to the semiconductor industry. After rigorous technical review only one technology, the Silent Discharge Plasma (SDP) developed at Low Alamos National Laboratory, was considered to successfully meet the required technical performance standards and potential cost effectiveness necessary for continued consideration by SEMATECH in their point-of-use emissions control plans.
Semiconductor device fabrication
Semiconductor Industry
Emerging Technologies
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The 3D-AFM technique is a very well known technique as a non destructive reference to calibrate CD-SEM and Scatterometry metrology. However, recent hardware, tip design and tip treatment improvements have offered to the technique new capabilities that pave the way for multiple applications in the semiconductor industry. The 3D-AFM technique is today not only a calibrating technique but also a process control technique that can be use either at the R&D level or in fab environment. In this paper, we will address the limits of the 3D-AFM technique for the semiconductor industry depending on the applications by focusing our study on tip to sample interactions. We will identify, test and validate potential industrial solutions that could extend the 3D-AFM potentialities. Subsequently, we will show some interesting applications of the technique related to LER/LWR transfer during silicon gate patterning and related to advance multiwires devices fabrication.
Semiconductor Industry
Semiconductor device fabrication
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ALSI or ALSICU may be used as metal connecting line in semiconductor manufacturing. About 0.5%~1% Si is put in ALSI or ALSICU to prevent ALSI penetration into P-N junction to produce junction spiking. In order to remove the Si residues on wafer's surface,the mechanisms and relative merits of Si residues removal methods used in semiconductor manufacturing industry at present are compared and analyzed,and a new Si residue dry removal method is proposed in this paper. The standardized Si residue removal process was laid down. The standard procedure presented in this paper for removing the Si residue has an extensive guiding function in semiconductor manufacturing industry.
Semiconductor Industry
Semiconductor device fabrication
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Different from other manufacturing processes, the unique complexity in semiconductor industry comes from multiple product mix, complicated manufacturing processes and the requirement for high machine utilization. So the production optimization in semiconductor industry is more complicated than in other industry sectors. In this article, heuristic method and linear programming based technique for capacity planning in semiconductor manufacturing are discussed.
Semiconductor device fabrication
Semiconductor Industry
Manufacturing
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Yield prediction is one of the most important topics in semiconductor manufacturing. Especiall y, for a fast-changing environment of the semiconductor industry, efficient forecasting techniq ues are required. In this study, we propose a procedure to predict wafer yield using classificat ion algorithms. The proposed procedure addresses imbalance problems frequently encountered in semiconductor processes so as to construct reliable prediction models. The effectiveness and applicability of the proposed procedure was demonstrated through a real data from a leading semiconductor industry in South Korea.
Semiconductor device fabrication
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The semiconductor industry utilizes vast freshwater resources for its high-tech manufacturing processes. This work will enumerate the impact of the global semiconductor manufacturing industry on water resources. A global inventory of semiconductor manufacturing capacity, in combination with an approximation of water use required to manufacture an individual semiconductor chip, will be used to estimate water consumption by each semiconductor fabrication facility and globally. A simplified water stress assessment will be conducted by multiplying facility water use data by a water scarcity factor. Maps of the scarcity weighted water use will be used to identify watersheds that may be disproportionately impacted by semiconductor manufacturing water use. This may be especially important for regions of growth in the semiconductor industry such as China and Southeast Asia. Once these areas have been identified a detailed water footprint for the facilities located in the subwatershed of interest can be conducted.
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Semiconductor Industry
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Scarcity
Manufacturing
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Test wafers (TWs) are used for equipment qualification purposes in semiconductor manufacturing. TW management is unique because of the possibility of downgrading a TW to test lower class processes. Since the yearly TW costs add up to several million dollars for a typical semiconductor fab, effective TW management can substantially reduce costs by identifying the right quantity of TWs to purchase, to downgrade, and to hold in the inventory. While the current industry practice is to use suboptimal rules to manage TWs, this paper develops a network-based formulation named TW Inventory Network (TWIN) to eliminate this suboptimality. Several special cases are analized here, and a numerical analysis is provided to shed further operational insights on the TW problem.
Semiconductor device fabrication
Downgrade
Semiconductor Industry
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The Adhesion and removal of small particles to surfaces is very important to many industries such as semiconductor manufacturing, imaging, aerospace, etc. In most cases, particles represents undesirable contaminants that lower product yield and cause defects. These particulate contaminants may be generated by the process or the product environment. The industry sets threshold specification for acceptable contamination for each generation of products.
Semiconductor Industry
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