Thermal management of power electronics modules packaged by a stacked-plate technique
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Power Electronics
Electronic Packaging
Power module
Packaging engineering
The paper will comment on the role of SiC power devices in compact power electronics, characterized by extremely small volumes and high power densities. Starting with a short introduction to the specific properties of silicon carbide power semiconductors it will be sketched how these features can be favourably used in order to minimize the volume of power electronic components. Especially fast Schottky barrier diodes as well as VJFET based power switches will be introduces and discussed. Examples will be given for typical solutions in power electronics like power supplies or frequency converters using SiC components. Finally, a critical consideration outlining the borders in power density and peripheral components will be added in order to point out that an isolated focus on the semiconductor components alone e.g. will not be sufficient for exploiting the full potential of high density power electronics.
Power Electronics
Power module
Power density
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As the market demands for high power and high efficiency power electronics, the industries has developed advanced IC technology and conceptual configuration. However, in order to guarantee the performance and reliability of the power electronics, the challenge of the packaging arises. This paper will use the thermal measurements and finite element method to describe the thermal impact of the geometric unflatness and imperfection of packaging process. The results show that the unflatness of the package substrate impacts the thermal performance. The thinner the die, the more sensitive the process imperfection (voids at die attach layer) is. Afterwards, we apply the concept of Design for Testability (DfT), and a potential online quality control method for the power electronic manufacturing is used and the method to obtain the testing parameter is proposed.
Electronic Packaging
Power Electronics
Packaging engineering
Power module
Integrated circuit packaging
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The evolution of power electronics devices in the semiconductor sector has created a strong need for power modules that have high efficiency and low power usage. The power package; which embraces a couple of power electronics devices such as switches and diodes; provides mechanical supports, electrical interface, protection, and thermal management to the power electronics devices. The power package is power dissipation, resulting in a significant challenge to its thermal management. To lower the expenses on wasted power and minimize the need for cooling systems, it is imperative for power converters and their control algorithm to offer exceptional efficiency in converting power. Hence, efficient thermal control and sophisticated thermal design are crucial in developing the power module. In this paper, health monitoring of the power modules is considered in the active thermal control of a two-level power rectifier using a sequence-based model predictive control method. This paper sets the stage for monitoring the thermal response and health of power electronics devices by early diagnosis of degradation. This declines the thermal stress and makes a prompt prediction of failure. This would enhance the reliability of the power converter.
Power Electronics
Power module
Rectifier (neural networks)
Insulated-gate bipolar transistor
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Electronic Packaging
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In this paper the importance of the power electronics integrated system in application is evaluated. The basic concepts of structure format and studing content of the power electronics modules are introduced and the new advancement of module packaging technology and its roles in the power electronics integrated system are also discussed.
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Electronic Packaging
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Power electronics, the basic technology for electric power conversion and control, has achieved great progress utilizing the advanced power semiconductor devices such as thyristor, GTO, IGBT and IPM. The application areas of power electronics are very wide from power utility systems and uninterruptible power sources to express train drives and robot arm drives. Combined with the progress of advanced control theories and microprocessors, power electronics has been playing an indispensable role in our society.
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Insulated-gate bipolar transistor
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Power engineering
Commutation cell
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Presents the power point presentations from the conference proceedings. Power electronics is the critical enabling technology at the intersection of renewable power generation, reliable power distribution and transmission, and efficient power utilization and storage. Issues of compact and high power density packaging, thermal management and reliability are the most important research areas for realizing the full potential of power electronics.
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Power transmission
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The authors present a power electronics packaging technology utilizing chip-scale packaged (CSP) power devices to build three-dimensional integrated power electronics modules (IPEMs). The chip-scale packaging structure, termed Die Dimensional Ball Grid Array (D/sup 2/BGA), eliminates wire bonds by using stacked solder bumps to interconnect power chips. It has the same lateral dimensions as the starting power chip, which makes high-density packaging and module miniaturisation possible. This package enables the power chip to combine excellent thermal transfer, high current handling capability, improved electrical characteristics, and ultra-low profile packaging. In this paper, the authors introduce the D/sup 2/BGA power chip-scale package, and present the implementation of these chip-scale packaged power devices in building 30 kW half-bridge power converter modules. The electrical and reliability test results of the packaged devices and the power modules are reported.
Ball grid array
Chip-scale package
Power module
Power Electronics
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Integrated circuit packaging
Wire bonding
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Demands for increasing power density and levels of functional integration in switch-mode power converters require power electronics manufacturers to develop innovative packaging solutions for power semiconductor devices and modules. Three-dimensional (3-D) packaging techniques offer the potential of lower resistance, higher current handling capability, smaller volume, better thermal management capability, and high reliability. In this paper, we present the constructions and some electrical and thermomechanical analyses of four 3-D packaging approaches that have been developed within the Center for Power Electronics Systems-an NSF Engineering Research Center.
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Electronic Packaging
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Integrated circuit packaging
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