Magnetic and electrical resistivity of RT2X2, RTX2 and RTX intermetallic compounds
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Materials Discovery
Despite ordered structure and well-defined stoichiometry, stable intermetallic compounds are challenging to predict even in binary systems because of the numbers of structures that depend on chemical composition and need to be considered. Incorporation of Bi is of particular interest because of the potentially distinctive properties that it could introduce into intermetallic materials. Using a density functional theory–based random structure searching approach, Altman et al. explored the high-pressure phase space of the Mo–Bi system and predicted stability of the stoichiometric compound MoBi2 of the CuAl2 structure type, the first group 6-Bi binary intermetallic structure confirmed experimentally. Additional electronic structure calculations revealed important correlations that could be useful in directing the synthesis of analogous intermetallic compounds of transition metals with Bi.
J. Am. Chem. Soc. 143 , 214 (2021).
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The present work explores the growing behavior of the intermetallic layer in the Mg‐Si system. Following achievements have been obtained in our investigation: (i) A complete wetting concept is proposed for the lateral spreading of the intermetallic layer. (ii) In contrast to the stoichiometric property for the intermetallic phase in the phase diagram, the authors show that concentration gradients are able to be established in the kinetic process. (iii) Contrary to the reported growth behavior, d ∝ t 0.25–0.5 in other intermetallics, the authors find a transition from d ∝ to d ∝ t with an increase of the temperature, where d is the thickness of the intermetallic layer and t is the time.
Stoichiometry
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The Fe-Al intermetallic compound powders were fabricated by mechanical alloying and heat treatment process. In this research, the phase composition and microstructure of the Fe-Al intermetallic compound powders produced by different milling time and heat treatment at 800oC and 1000oC were investigated. The XRD patterns results showed that the Fe-Al intermetallic compound powders were fabricated by mechanical alloying for 60h. After heat treatment at 800oC and 1000oC, the Fe-Al intermetallic compound powders transformed into the Fe3Al powders. With the increase of milling time, the mechanical alloying extent of Fe-Al intermetallic compound powders would be increased remarkably, and the particles sizes decreased remarkably. The microstructure showed that the mean particles size of the Fe-Al intermetallic compound powders after milling for 60h was rather fine and about 4-5μm. The microstructures showed that mean particles size of the Fe3Al intermetallic compound powders produced by heat treatment at 800oC and 1000oC was also about 4-5μm.
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In this era, intermetallic technology going to take a broad advantage with its presence in high-temperature processing materials. This chapter gives a brief idea of the intermetallic compound. This chapter shows how their presence can improve the materials' properties. Various structures of the intermetallic compound and their classification have been discussed. Applications in aerovehicle industries, automobile industries, and electrical industries have been stated here.
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AbstractAbstractThe growth kinetics of intermetallic compound layers formed between Sn–5Bi–3.5Ag solder and Cu substrate were investigated at temperatures between 70°C and 200°C for 0 to 60 days. A quantitative analysis of the intermetallic compound layer thickness as a function of time and temperature was performed. Diffusion couples showed a composite intermetallic layer comprised of Cu6Sn5 and Cu3Sn. The growth of intermetallic compounds followed diffusion controlled kinetics and the layer thickness reached only 10 μm after 60 days of aging at 150°C. The apparent activation energies calculated for the growth of the total intermetallic compound (Cu6Sn5 + Cu3Sn), Cu6Sn5 and Cu3Sn intermetallic are 88.6, 84.3 and 70.28 kJ mol-1, respectively.
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Ductility (Earth science)
Powder Metallurgy
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Crystallization and redissolution of giant intermetallic compounds in Al-4.5%Mg alloys containing 0.25%Cr were studied. Giant intermetallic compounds in those alloys crystallized at temperatures from 640°C to 680°C. The higher the crystallization temperature is, the larger the size is and the less the number is. The compounds redissolve so slightly in molten alloys and it takes an hour to dissolve even at 800°C. A giant intermetallic compound CrAl7 has micro-vikers hardness Hv 429 and density 3.12g/cm3.
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Abstract Interfacial reactions and mechanical properties between the Cu and Pb-free solders, Sn-3.0Ag-0.5Cu and Sn-58Bi with addition of 0.1 to 1.0 wt.% Pb are investigated in this study. Two kinds of intermetallic compounds, scallop-shaped Cu 6 Sn 5 and plane layered Cu 3 Sn phases, were found in both Sn-3.0Ag-0.5Cu + Pb/Cu and Sn-58Bi + Pb/Cu couples. The intermetallic compound thickness increased with longer reaction times, higher reaction temperatures and greater Pb contents. The Cu 6 Sn 5 phase was the thicker intermetallic compound in the Sn-3.0Ag-0.5Cu + Pb/Cu couple. However, in the Sn-58Bi + Pb/Cu system, the Cu 3 Sn phase is the thicker intermetallic compound. Experimental results indicate that the higher Pb concentration in Sn-3.0Ag-0.5Cu or Sn-58Bi solders reduces the alloy liquidus temperature and increases the thickness of the intermetallic compound. Thicker intermetallic compounds reduce the mechanical strength of the solder joint.
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