Investigation on Recrystallization of Cu-Nb Micro-composites by the Method of Resistance
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In this paper, high strength and high conductivity Cu-18%vol.Nb micro-composites were fabricated by the bundling and drawing process. The materials experienced severe plastic deformation during the repeating bundling process, which accumulated plenty of dislocations and vacancies among Cu/Nb interface, Cu matrix and Nb filaments. The morphology of Cu matrix recrystallization has been observed. And it exhibits great difference between Cu at the edge area and that adjoining Nb filaments. Resistance measurements are introduced to realize the recrystallization behaviour of this kind of materials. The introduction of Nb elements to Cu shown great influence on the form of dislocations and deformation twins, and resistivity of Cu matrix varies significantly with the addition of filaments connecting with changes of defect density.Keywords:
Recrystallization (geology)
The electrical resistivity of TiB2 has been measured using a DIA-6 cubic anvil apparatus at pressures up to 8 GPa and temperatures up to 800 K. The ambient-condition resistivity is determined to be 13.3 (±0.9) μΩ cm. The resistivity decreases with increasing pressure. At pressures above 2 GPa, the pressure dependence of the resistivity is about −0.36 μΩ cm/GPa. On heating, the resistivity increases linearly with temperature. The measurements at simultaneously high pressure (3.2 GPa) and high temperatures yield a temperature dependence of 46 (±5) nΩ cm/K for the resistivity.
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ADVERTISEMENT RETURN TO ISSUEPREVArticleNEXTUsing a Simulated Industrial Setting for the Development of an Improved Solvent System for the Recrystallization of Benzoic Acid: A Student-Centered ProjectTimothy R. Hightower and Jay D. Heeren View Author Information Department of Chemistry, Black Hills State University, Spearfish, SD 57799Cite this: J. Chem. Educ. 2006, 83, 11, 1663Publication Date (Web):November 1, 2006Publication History Received3 August 2009Published online1 November 2006Published inissue 1 November 2006https://pubs.acs.org/doi/10.1021/ed083p1663https://doi.org/10.1021/ed083p1663research-articleACS PublicationsRequest reuse permissionsArticle Views1863Altmetric-Citations-LEARN ABOUT THESE METRICSArticle Views are the COUNTER-compliant sum of full text article downloads since November 2008 (both PDF and HTML) across all institutions and individuals. These metrics are regularly updated to reflect usage leading up to the last few days.Citations are the number of other articles citing this article, calculated by Crossref and updated daily. Find more information about Crossref citation counts.The Altmetric Attention Score is a quantitative measure of the attention that a research article has received online. Clicking on the donut icon will load a page at altmetric.com with additional details about the score and the social media presence for the given article. Find more information on the Altmetric Attention Score and how the score is calculated. Share Add toView InAdd Full Text with ReferenceAdd Description ExportRISCitationCitation and abstractCitation and referencesMore Options Share onFacebookTwitterWechatLinked InRedditEmail Other access optionsGet e-Alertsclose SUBJECTS:Impurities,Purification,Solvents,Students Get e-Alerts
Recrystallization (geology)
Benzoic acid
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Electrical resistivity has been measured in the intermetallic compounds REAl6Fe6. A broad curvature of the electrical resistivity against temperature curve in the temperature range around TC was observed. Very large residual resistivity of about two-thirds of the total high temperature resistivity is indicated for all compounds. Electrical resistivity due to spin disordering tends to increase within the RE series. The Curie temperature as obtained from the electrical resistivity is in the range 320-350 K.
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The effect of solution-treatment prior to cold-rolling on the textures of Al-Cu alloys was studied by the X-ray pole figure method. The following results were obtained:(1) No marked effect of the solution-treatment on the cold-rolling textures of Al-Cu alloys was observed.(2) The recrystallization textures varied remarkably by the solution-treatment. The recrystallization textures of Al-Cu alloys which had not been solution-treated were found to be composed of two preferred orientations of (100)[001] and (632)[5\bar5\bar7] or (113)[33\bar2]. Whereas the recrystallization textures of Al-Cu alloys which had been solution-treated before rolling consisted of two preferred orientations of (100)[001] and (110)[1\bar10]. The amount of the (100)[001] type component in the recrystallization textures was increased by the solution-treatment before rolling.(3) The orientation relationships between the preferred orientations in the cold-rolling texture and those in the recrystallization texture can be expressed as 〈111〉 rotations of 20° to 40°.(4) The variation of the recrystallization texture by the solution-treatment prior to cold-rolling may be attributed partly to the change in the distribution of precipitates during the incubation period of the primary recrystallization, which has influence on the selective nucleation or growth of the nuclei, and partly to the suppression of the random nucleation around the precipitated particles.
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Dynamic Recrystallization
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M-28 SOME CONSIDERATIONS ON THE APPARENT RESISTIVITY IN THE CROSS HOLE RESISTIVITY METHOD I.K. CHO 1 J.H. KIM 2 and S.H. CHUNG 2 INTRODUCTION 1 For dc resistivity method conversion to apparent resistivity can be thought of as simply a normalization of the measured potential difference for the transmitted current and the geometric factor of the array so that the data can be presented in units of the intrinsic rock property-resistivity. In reality the sub-surface ground is not a homogeneous medium and thus the resistivity obtained is no longer the 'true' resistivity but the apparent resistivity which can even be
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Carbon fibers
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The electrical resistivity of amorphous Ni80−xMxB16Si4 alloys, M standing for any of the 3d transition metals, was studied in the temperature range ∼2–950 K. The resistivity versus M plots (at constant x) yield typical double-peaked curves, with a minimum at Mn. The origin of this resistivity behaviour is discussed. All the samples show a resistivity minimum, probably due to Kondo effect, at Tmin, which is strongly composition dependent. Negative temperature coefficients of resistivity found about room temperature for several alloys are the consequence of Tmin lying well above room temperature for those alloys.
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This report reviews the rationale for selection of the two-step recrystallization process that is being developed, presents the results of the latest first-step recrystallization experiments, and outlines the calculations appropriate to the design of second-step thermal process experiments. Results of a computer run for first-step recrystallization are also presented. The report concludes with an updating of the results obtained from the thermal and pulsed electron beam annealing of shallow implanted GaAs.
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Levels of recrystallization have been measured by two distinct techniques; a splat cooling assay and a new device, an optical recrystallometer, which measures the change in light transmittance through a frozen sample. Both techniques indicate the presence of recrystallization inhibitors in a grass extract and in other samples. The advantages of each method of measuring recrystallization are discussed.
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Dynamic Recrystallization
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