Progress on thermally conductive adhesive for electronic packaging
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Abstract:
With the development of miniaturization of electrical and electronic components, the dissipation of heat has become urgent issue. TCAs play an important role in bonding and packaging of electronic devices and resolve the problem of heat dissipation. Currently, the research on TCAs involves preparation of filler, modification of filler surface, filling model and the influence of interface between filler and matrix resin on heat conductivity and other properties of TCAs. Many researchers have made contribution to the theory model and mechanism of TCAs, but there is no a theory or model that can be suitable for all types of fillers. So it's a long way to go for the development of TCAs, and we believe that TCAs will bring revolutionary change for the electrical and electronic developments.Keywords:
Filler (materials)
Electronic Packaging
Electronic component
We have designed multichip modules using three alternative technologies for a variety of applications, and have used the results to study the impact of miniaturization and passive component integration on module size, distribution of net length and estimated cost. We have chosen representative applications that include: a digital application with dense interconnections, a mixed-signal application for low-end portable electronics and an analog application requiring a large number of passive components. We compare conventional, laminate-based MCM technology with advanced thin-film-on-laminate technology and silicon-based thin-film MCM technology. We find that the advanced highly miniaturized technologies result not only in higher packaging density and shorter average net length, but in lower estimated module cost as well. Passive component integration can also lower module cost especially in mixed-signal and analog applications.
Electronic component
Component (thermodynamics)
Mixed-signal integrated circuit
System Integration
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In power electronics, design of power supply is always tending to miniaturization. Passive components represent the main part of the volume. Integrating these elements is a major keypoint to reach a high level of reduction. In order to achieve this, different works have already begun in the world (Chen, 2003). In this paper, we present research on volumes of passive components reduction, inductor-transformer-capacitor. This is fundamental for the miniaturization of all structures of power electronics. One way to achieve this goal is to combine these three passive elements in only one passive component called LCT. We see how physical limits of this association are constrained by the possible capacitor value considering the dielectric performances. In a second part, a new topology of converter called mixed energy transfer (MET) structure adapted to the LCT is introduced; it can offer industrial interests in a near future. This topology is compared with more classic ones to demonstrate its advantages
Electronic component
Power Electronics
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Power Electronics
Power module
Electronic Packaging
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Interface (matter)
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Electronic component
Aluminium nitride
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Thermoacoustic devices provide an interesting approach to thermal management of high density and high power microelectronics. They are simple, they have no moving parts (except for the acoustic driver) they use gases which are environmentally safe, and they have sufficient efficiency for handling power dissipation problems in electronic circuits. This paper discusses how the efficiency, performance, and components of thermoacoustic devices will be affected by miniaturization and the benefits of a thermoacoustic approach. The components, the interactions between components, and their response on circuits will be affected by their reduction in size; novel materials will have to be developed for certain parts of this application.
Microelectronics
Thermoacoustics
Thermoacoustic heat engine
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With the rapid development of high frequency, high integration of electronic components and the integrated circuit technique, and the great improvement of MEMS, their power density are significantly increased, which leads to higher temperature environment affecting the performance of themselves. More effective heat control is required. Therefore, it is the key technique in the packing and fabricating process that effectively solving the problem of heat dissipation in electronic components. The paper summed up the principles and various cooling methods to eliminating temperature effects in the actual application.
Electronic component
Power density
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Electronic component
SIGNAL (programming language)
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Electronic component
Cost reduction
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The demand for increasing miniaturization of electronic systems enforces component manufacturers to develop new generations of small-sized components to cope with the required high component density. Reducing the size of individual components beyond the 0402 size seems not to be the best solution, as further miniaturization is limited by interconnection and placement requirements. In the design of ceramic multicomponent modules (CMM's), a different approach is followed. Employing well-accepted technologies, based on a high quality ceramic multilayer technology and thick- (or thin-) film resistor networks, customer specific modules are realized through the integration of capacitors and resistors into a single ceramic module. In addition, active elements can be mounted on top. In this way a high density of (passive) functions can be obtained in an easy mountable package. The CMM concept will be explained. In addition, the possibilities for miniaturization are addressed. Furthermore, the aspect of interconnecting the CMM to the printed circuit board (PCB) is discussed.< >
Electronic component
Ceramic capacitor
Component (thermodynamics)
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