Electrostatic potentials for metal-oxide surfaces and interfaces
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As most technologically important metals will form oxides readily, any complete study of adhesion at real metal surfaces must include the metal-oxide interface. The role of this ubiquitous oxide layer cannot be overlooked, as the adhesive properties of the oxide or oxide-metal system can be expected to differ profoundly from the adhesive properties of a bare metal surface. We report on the development of a computational method for molecular-dynamics simulations, which explicitly includes variable charge transfer between anions and cations. This method is found to be capable of describing the elastic properties, surface energies, and surface relaxation of crystalline metal oxides accurately. We discuss in detail results using this method for \ensuremath{\alpha}-alumina and several of its low-index faces.OBJECTIVE The adhesive characteristics and factors affecting properties of the adhesive tablets were studied. METHODS The adhesive tablets with different composition of Carbopol and HPMC were prepared and the adhesive characteristics such as adhesive force, swelling rate and adhesive times were determined. RESULTS The results showed that the adhesive force and swelling rate of Carbopol-HPMC adhesive tablets decreased while the amount of HPMC raised,and the adhesive times were related to the ratio between Carbopol and HPMC. CONCLUSIONS The adhesive tablets have suitable adhesive force, swelling rale and adhesive time when the ratio of Carbopol to HPMC is 1 :1 or 1 :2.
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본 연구에서는 유도무기의 탐색기에 적용되는 지존 접착제의 대체 가능성을 조사하기 위해 환경인자의 노출시간에 따른 기존 접착제와 대제 접착제의 접착전단장도들을 평가하고 이들의 화학구조 변화를 조사하였다. 이때 접착제는 기존 접착제와 대체 접착제에 대해 각각 구조용 접착제와 실링용 접착제의 두 종류를 고려하였다. 이들 접착제는 온도, 수분, 자외선 등의 복합적인 환경인자에 최대 1000시간 동안 노출시켰다. 환경인자의 노출시간에 따른 접착제의 접착전단강도를 평가하기 위해 접착전단시험을 수행하고 화학구조 변화를 조사하기 위해 ATR 적외선 분광분석을 수행하였다. 연구결과에 따르면 대체 접착제의 접착전단강도는 기존 접착제의 경우에 비해 높으며 환경인자의 노출에도 매우 안정적으로 나타나 대체 접착제는 기존 접착제의 대체용으로 적용이 가능함을 알 수 있었다. Adhesive shear strengths of the established adhesives and the alternative adhesives were evaluated and their chemical structures were analyzed in order to investigate the possibility of replacing the established adhesives with the alternative adhesives applicable to the seeker for the guided missiles. Two types of the adhesives such as the structural adhesives and the sealant adhesives were considered. Those adhesives were exposed to the combined environmental factors consisting of temperature, moisture and ultraviolet over 1000 hours. Adhesive shear test was conducted to evaluate adhesive shear strengths and ATR FT-IR was utilized to investigate chemical structures. According to the results, the adhesive shear strengths of the alternative adhesives revealed higher than those of the established adhesives. Also the alternative adhesives were more stable to the combined environmental condition than the established adhesives. Therefore, it is found that the established adhesives were able to be replaced by the alternative adhesives.
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The research prograss of heat-resistant adhesive cured at room temperature is reviewed in this essay.Several kinds of organic adhesives such as epoxy resin adhesive(EP) and organosilicon adhesive are introduced and some inorganic adhesives are involved.In the end,the development trends of the adhesive are put forward.
Organosilicon
Epoxy adhesive
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The paper presents the results of research on the UV radiation influence on the self-adhesive properties of silicone adhesives. The adhesives were obtained by cross-linking commercial resins (PSA 590, Q2-7566) at the temperature of 110°C, using different amounts (0–3 wt%) of bis(2,4-dichlorobenzoyl) peroxide. Self-adhesive properties of adhesives such as adhesion, tack, and durability before and after aging were determined. The adhesives showed stable self-adhesive properties, however, the PSA 590 adhesive had a higher maximum operating temperature than the Q2-7566 adhesive.
Pressure sensitive
Self adhesive
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본 연구에서는 유도무기의 탐색기에 적용되는 지존 접착제의 대체 가능성을 조사하기 위해 환경인자의 노출시간에 따른 기존 접착제와 대제 접착제의 접착전단장도들을 평가하고 이들의 화학구조 변화를 조사하였다. 이때 접착제는 기존 접착제와 대체 접착제에 대해 각각 구조용 접착제와 실링용 접착제의 두 종류를 고려하였다. 이들 접착제는 온도, 수분, 자외선 등의 복합적인 환경인자에 최대 1000시간 동안 노출시켰다. 환경인자의 노출시간에 따른 접착제의 접착전단강도를 평가하기 위해 접착전단시험을 수행하고 화학구조 변화를 조사하기 위해 ATR 적외선 분광분석을 수행하였다. 연구결과에 따르면 대체 접착제의 접착전단강도는 기존 접착제의 경우에 비해 높으며 환경인자의 노출에도 매우 안정적으로 나타나 대체 접착제는 기존 접착제의 대체용으로 적용이 가능함을 알 수 있었다. 【Adhesive shear strengths of the established adhesives and the alternative adhesives were evaluated and their chemical structures were analyzed in order to investigate the possibility of replacing the established adhesives with the alternative adhesives applicable to the seeker for the guided missiles. Two types of the adhesives such as the structural adhesives and the sealant adhesives were considered. Those adhesives were exposed to the combined environmental factors consisting of temperature, moisture and ultraviolet over 1000 hours. Adhesive shear test was conducted to evaluate adhesive shear strengths and ATR FT-IR was utilized to investigate chemical structures. According to the results, the adhesive shear strengths of the alternative adhesives revealed higher than those of the established adhesives. Also the alternative adhesives were more stable to the combined environmental condition than the established adhesives. Therefore, it is found that the established adhesives were able to be replaced by the alternative adhesives.】
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EDX analysis method can measure the elements contents and changes of the adhesive in adhesive-PI joints.There are different elements contents and changes between the adhesive and PI film,the weight loss of the adhesive in adhesive-PI joints can be measured with EDX,so the heat decomposition dynamics of the adhesive in the joints can be calculated.Compared with the values of heat decomposition energy of the adhesive under different conditions,it is indicated that the heat decomposition energy of the adhesive in the joints is lower than that of the adhesive in air atmosphere.This analysis method is a new method for measuring the properties of adhesive in the joints.
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This paper reviewed the progress in the adhesive for polyethylene and analyzed the reasons of hard adhesive to polyethylene. We put the emphases on the discussion of the adhesive, such as modified acrylic adhesive, PU adhesive, SBS adhesive, pressure-sensitive adhesive, modified EVA adhesive, chlorinated polypropylene adhesive and other adhesives used for PE. We also analyzed the actuality of the adhesive for PE and the direction in future.
Pressure sensitive
Polypropylene
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Recently, a novel adhesive which can be dismantled has been developed. The adhesive, so called "dismantlable adhesive", consists of resin and thermally expansive microcapsule. Since the adhesive expands greatly as the temperature increases, joints bonded with it can be peeled off due to internal stress caused in the adhesive layer. In order to investigate the expansion and dismantlability of the adhesive and the joint, we measured the thermal expansion of the adhesive and observed the interface between the adhesive and adherends. In addition, cleavage between the adhesive and glass adherends at high temperature was observed.
Expansive
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Environmentally Friendly
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The use of various adhesives and adhesive binders in the composition of organoplastics is shown, as well as the use of adhesives for gluing structural elements made of organoplastics in the composition of products. Examples of the use of VK-3 film adhesive as part of VKO-20 and VKO-2TB organoplastics, VK-36RT adhesive as part of VKO-19, VKO-19L organoplastics, VSK-14-2m adhesive binder as part of VKO-24 organoplastics are given. The results of the use of VK-41M adhesive in the composition of the Alor D16/41 aluminum organoplastic and the use of this material in the An-124 aircraft are presented.
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