Magnetic and Thermal Properties of Cubic Single-Crystal PrCu4Ag
Shuai ZhangYosikazu IsikawaTakashi TayamaTomohiko KuwaiT. MizushimaMitsuhiro AkatsuYuichi NemotoTerutaka Gotô
5
Citation
20
Reference
10
Related Paper
Citation Trend
Abstract:
We succeeded in synthesizing a new cubic intermetallic compound PrCu 4 Ag in a fcc structure. Measurements of X-ray diffraction, magnetic susceptibility, magnetization, specific heat, electrical resistivity, thermal expansion, and elastic constants have been performed on single crystals of PrCu 4 Ag. A maximum value of χ( T ) with a corresponding peak in C ( T ) suggests that an antiferromagnetic phase transition occurs at T N = 2.4 K, where a sudden decrease in ρ 4 f ( T ) and a sharp peak in the thermal expansion coefficient α( T ) were observed. Characteristic Curie-type softening was observed in the temperature dependence of the transverse mode for ( C 11 - C 12 )/2 and C 44 from 70 K down to T N , which implies that the crystalline electric field (CEF) ground state is the magnetic triplet Γ 5 . The anisotropic properties in M ( T , H ) and C ( T , H ) are studied when the external magnetic field is applied in the <100>, <110>, and <111> directions. Another anomaly observed at approximately 10 K in χ( T ) is considered to be related to possible disorder behavior. The low- T behavior and the possibility of quadrupole fluctuation are discussed with respect to the CEF effect. All the experimental results in the present study are summarized in a magnetic phase diagram.Cite
Citations (29)
Cite
Citations (37)
Atmospheric temperature range
Cite
Citations (126)
The present work explores the growing behavior of the intermetallic layer in the Mg‐Si system. Following achievements have been obtained in our investigation: (i) A complete wetting concept is proposed for the lateral spreading of the intermetallic layer. (ii) In contrast to the stoichiometric property for the intermetallic phase in the phase diagram, the authors show that concentration gradients are able to be established in the kinetic process. (iii) Contrary to the reported growth behavior, d ∝ t 0.25–0.5 in other intermetallics, the authors find a transition from d ∝ to d ∝ t with an increase of the temperature, where d is the thickness of the intermetallic layer and t is the time.
Stoichiometry
Cite
Citations (8)
The Fe-Al intermetallic compound powders were fabricated by mechanical alloying and heat treatment process. In this research, the phase composition and microstructure of the Fe-Al intermetallic compound powders produced by different milling time and heat treatment at 800oC and 1000oC were investigated. The XRD patterns results showed that the Fe-Al intermetallic compound powders were fabricated by mechanical alloying for 60h. After heat treatment at 800oC and 1000oC, the Fe-Al intermetallic compound powders transformed into the Fe3Al powders. With the increase of milling time, the mechanical alloying extent of Fe-Al intermetallic compound powders would be increased remarkably, and the particles sizes decreased remarkably. The microstructure showed that the mean particles size of the Fe-Al intermetallic compound powders after milling for 60h was rather fine and about 4-5μm. The microstructures showed that mean particles size of the Fe3Al intermetallic compound powders produced by heat treatment at 800oC and 1000oC was also about 4-5μm.
Cite
Citations (0)
In this era, intermetallic technology going to take a broad advantage with its presence in high-temperature processing materials. This chapter gives a brief idea of the intermetallic compound. This chapter shows how their presence can improve the materials' properties. Various structures of the intermetallic compound and their classification have been discussed. Applications in aerovehicle industries, automobile industries, and electrical industries have been stated here.
Cite
Citations (2)
AbstractAbstractThe growth kinetics of intermetallic compound layers formed between Sn–5Bi–3.5Ag solder and Cu substrate were investigated at temperatures between 70°C and 200°C for 0 to 60 days. A quantitative analysis of the intermetallic compound layer thickness as a function of time and temperature was performed. Diffusion couples showed a composite intermetallic layer comprised of Cu6Sn5 and Cu3Sn. The growth of intermetallic compounds followed diffusion controlled kinetics and the layer thickness reached only 10 μm after 60 days of aging at 150°C. The apparent activation energies calculated for the growth of the total intermetallic compound (Cu6Sn5 + Cu3Sn), Cu6Sn5 and Cu3Sn intermetallic are 88.6, 84.3 and 70.28 kJ mol-1, respectively.
Cite
Citations (12)
Brittleness
Ductility (Earth science)
Powder Metallurgy
Cite
Citations (2)
Abstract Interfacial reactions and mechanical properties between the Cu and Pb-free solders, Sn-3.0Ag-0.5Cu and Sn-58Bi with addition of 0.1 to 1.0 wt.% Pb are investigated in this study. Two kinds of intermetallic compounds, scallop-shaped Cu 6 Sn 5 and plane layered Cu 3 Sn phases, were found in both Sn-3.0Ag-0.5Cu + Pb/Cu and Sn-58Bi + Pb/Cu couples. The intermetallic compound thickness increased with longer reaction times, higher reaction temperatures and greater Pb contents. The Cu 6 Sn 5 phase was the thicker intermetallic compound in the Sn-3.0Ag-0.5Cu + Pb/Cu couple. However, in the Sn-58Bi + Pb/Cu system, the Cu 3 Sn phase is the thicker intermetallic compound. Experimental results indicate that the higher Pb concentration in Sn-3.0Ag-0.5Cu or Sn-58Bi solders reduces the alloy liquidus temperature and increases the thickness of the intermetallic compound. Thicker intermetallic compounds reduce the mechanical strength of the solder joint.
Liquidus
Cite
Citations (4)