Silver dendrite-based nanocomposites for current cutting-off fuse
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Microelectronics and micromechanical systems (MEMS) are gaining popularity by virtue of small size, high integration, diverse functionalities, mass production and low cost. However, the existing current cutting-off fuse components can hardly be used in a microelectronics or micromechanical system to realize circuit protection due to their large size and high fusing current. Herein we report a novel current cutting-off fuse component based on printed electrically conductive nanocomposites (ECCs), which are composed of silver microdendrites with fractal morphology as the fusible conductive fillers and the thermosetting resin matrix. The silver paste was pasted between two copper electrodes with controlled space. The current cutting-off performance of the fuses was investigated within different silver fillers, various paste sizes, and diverse electrode spaces. The results show that, the silver dendrite-based paste can be fused at a relative low current due to its abundant nano-sized rims at the edge of the dendrite branches. Furthermore, the minimum fusing current (530 mA) was achieved when the silver flake-based paste was dispensed between two electrodes with distance of 100 μm and width of 30 μm. It is obvious that the fusing current attenuates gradually with the increase of space between two copper electrodes, and the silver paste in large spot size possesses higher fusing current than in small one. The scanning electron microscopy (SEM) analyses suggest that the silver fillers go through the melting and shrinking stages during the fusing process, thus the adjacent silver fillers separate to break the circuit. Considering the low material cost and negligible environmental risk, this novel current cutting-off fuse can provide cost-effective and environmental-friendly protection for MEMS devices.Keywords:
Microelectronics
Fuse (electrical)
Dendrite (mathematics)
Screen printing
Electroforming
Nickel-electroforming is used for obtaining a nickel-replica by means of electrodepositing nickel on a mold.In recent years, electroforming technique has made great progress, yet there remained some difficult problems to be solved.Of these problems, it is most essential for electroforming engineers to find out suitable methods for separating the electroformed shell from mold.By this study, it was revealed that the high tensile stress, generated in the electroformed nickel, might oppose to the separation of the electroformed shell from mold.It was also observed that, if the electroformed Nickel has extremely low tensile stress or compressive stress, the electroformed shell might easily be separated from mold.
Electroforming
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塑造的费用的 electroformed 镍班机的二种类型被 elec-troforming 技术准备。X 光检查衍射(XRD ) ，传播电子显微镜学(TEM ) ，电子 backscattering 衍射(EBSD ) 技术和高分辨率电子显微镜学(HREM ) 被采用了调查在塑造的费用的 electroformed 镍班机形成的水晶缺点。没有任何添加剂，(100 ) 与成年方向平行的纤维质地在使用准备的 electroformed 镍存在的结果表演指导当前的 electroforming，并且(111 ) 纤维质地在与添加剂使用直接当前的 electro-forming 准备的 electroformed 镍存在。使用直接当前的 electroforming 准备的存款在长度在宽度和 170 m 与 30 m 的一种平均谷物尺寸拥有圆柱的谷物。与添加剂准备的存款由有谷物的结构大约 29 nm 缩放的一个殖民地组成，并且很多水晶背叛例如双胞胎，反相边界和叠的差错在 electroformed 镍被观察了。
Electroforming
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The parts processed by micro-electroforming technology always have the defects of uneven electroforming deposits,resulting in very poor quality and performance.In light of non-uniformity of micro-electroforming,the process of(micro-electroforming) is introduced,and the factors influencing the uniformity of micro-electroforming deposits are reviewed both geometrically and electrochemically.
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In this paper, an effective method is presented to improve thickness uniformity in nickel electroforming process. In most electroforming processes, thickness ratio of edge to center is 2.5~4 and the shape of the electroforming zone is naturally a concave. Dividing conductive zone of electroforming structure to redistribute current density was applied to improve electroforming uniformity. Theoretical analysis and experimental results verify that a proper dividing method can improve the electroforming uniformity effectively. In the experiment, the thickness ratio of edge to center decreases from 2.91 to 1.88.
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Electroforming process can manufacture precision parts that conventional mechanical processing methods can't do.With the greatly increasing demand for all kinds of tiny complex shaped precision parts,electroforming technology manufacture precision parts has been highly regarded in the worldwide,which has promoted electroforming technology further.In addition,because the new progress in the field of electrochemistry has also created conditions for the development of electroforming technology,at present,special kind parts electroforming process,new high-performance electroforming materials and research on electroforming equipment will be the direction of electroforming technology development.
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Electroforming is an important constituent of micro machining, micro-parts and composite obtained by Electroforming have been widely used. Process and characteristics of Electroforming are reviewed. Development and applications in practical engineering of Electroforming are introduced.
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t is possible to get electroforming deposit with numerous special functions by adoption of traditional electroforming technique, but in which there are defects such as uneven electroforming deposit and unstable performance, etc. In order to enhance the quality and speed of electroforming deposit, this article has proposed the particle flow erosion precision electroforming technology, particle flows such as huge amount of micro glass bead is used in the process of electro-deposit for erosion of electroforming deposit surface, so that micro glass beads continuously abrade and impact cathode surface. As indicated in electroforming test of metallic nickel, in comparison with traditional electroforming technology, particle flow erosion precision electroforming technology can effectively change the microscopic structure of electroforming deposit, refine grain and realize evener distribution of grains, so as to reduce the diffracted intensity of all crystal faces and enhance mechanical property of electroforming deposit.
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We study electroforming on the resistive switching (RS) behavior of silver-manganite interfaces. Using the technique of hysteresis switching loops we define an electroforming procedure that enables us to study its influence on the RS behavior in a systematic manner. We show that two similar electroforming procedures may lead to either RS or no RS at all. We explain the observed behavior by associating the forming procedure and the memory switching operation to major and minor hysteresis loops, respectively. With the obtained insight we propose a simple and nearly optimal electroforming procedure.
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