Structure and method of packaging for photonic device

The present disclosure provides a packaging device comprising a photonic device and a method of packaging. The packaging includes an insulating structure. The packaging includes first and second conductive structures that each extend through the insulating structure. A substantial area of a bottom surface of the light-emitting diode device is in direct contact with a top surface of the first conductive structure. A top surface of the light-emitting diode device is bonded to the second conductive structure through a bonding wire. The photonic device provided by the invention has strong heat dissipation ability. The 'piling' method of the embodiment facilitates simplification of manufacturing processes and production on manufacturing cost. In addition, there is no need to form a hole channel with high aspect ratio.