High Reliable Nanofiller Reinforced Composite Based Flexible Heat Sink for Wearable Devices with Micromachining Technology

The wearable device develops rapidly in recent years and will be widely used in our daily life with the maturity of the fifth communications technology. Accordingly, the power density is increased greatly due to the pursuit of functional diversity and miniaturization. Thus, the thermal management of the flexible device is urgent. So this study proposed a nanofiller reinforced composite based flexible heat sink to improve the thermal mechanical reliability of the flexible device. Based on the micromachining processes together with micro-etching and polishing, the proposed new design is fabricated. The maximal temperature of the heat sink with pin-fin is below 44 °C and the thermal stress reduced about 21.9% than the initial design. Based on its advantages of being high thermal reliability, biocompatibility, mechanically flexible and process compatibility, the proposed flexible heat sink with pin-fin integrated with the flexible chip has potential utility wearable device to maintain the device has safe operation.