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Electrical Characterization of Solder Joint by Plating-free Bumping with Cu nanopaste and Injection Molded Solder Method
Electrical Characterization of Solder Joint by Plating-free Bumping with Cu nanopaste and Injection Molded Solder Method
2020
Marushima Chinami
Aoki Toyohiro
Yamaguchi Ryota
Kohara Sayuri
Nakamura Eiji
Sekine Nobuhiro
Sueoka Kuniaki
Yatsugi Kenichi
Yada Makoto
Hisada Takashi
Keywords:
Metallurgy
Soldering
Materials science
Bumping
plating
Joint (geology)
Correction
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