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High-precision Wafer-level Cu-Cu Bonding for 3DICs
High-precision Wafer-level Cu-Cu Bonding for 3DICs
2015
Okada Masashi
Sugaya Isao
Mitsuishi Hajime
Maeda Hidehiro
Izumi Shigeto
Nakahira Hosei
Okamoto Kazuya
Keywords:
Wafer
Optoelectronics
Materials science
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