The photosensitive resin composition, a photosensitive film, a manufacturing method of the permanent resist and a permanent resist

The present invention is, (a) component: acid-modified epoxy resin, (b) component: a photopolymerizable monomer having an ethylenically unsaturated group, (c) component: a photopolymerization initiator, (d-) component: epoxy resin, and component (e): a photosensitive resin composition containing an inorganic filler, wherein the component (a) contains an acid-modified bisphenol novolak epoxy resin, further predetermined condition is satisfied photosensitive resin composition, and photosensitive film using the same, to provide a method of manufacturing a permanent resist and permanent resist.