Properties and low loss packing of $LiNbO_3$ Optical Modulator for a Broadband Optical Communications

The issues that influence the packaging of high-speed LiNbO modulators are discussed, and packaging approaches that result in only minor degradation of the modulator's RF performance are described. The primary problems dealt in this paper, associated with high-speed device packaging, are fallen into the following five categories: die features, pigtailing, suppression of RF package resonance, RF launcher approach, termination approach. By considering factors to influence the modulator performance in packaging, a LiNbO intensity modulator was fabricated and packaged to have S21 better than -3㏈ upto 10㎓ and S11 below -l5㏈ upto 18㎓.