The manufacturing method and the circuit module

PROBLEM TO BE SOLVED: To provide a circuit module having low cost and high reliability.SOLUTION: A circuit module 1 of the present invention includes a first resin molding 2 holding at least a circuit part 3 and terminal members 4, and a second resin molding 5 tightly covering the circuit part 3. The first resin molding 2 includes a terminal supporting part 20 for supporting the terminal members 4 drawn in the vertical direction to the circuit part 3, plane parts 21 formed with a constant width Wfrom an outer peripheral edge of the circuit part 3 and exposed from the second resin molding 5, and supporting parts 22 forming a space of a constant height H between a surface of the plane part 21 and the circuit part 3.