Electrodeposition behavior and characterization of copper-zinc alloy in deep eutectic solvent

Cu–Zn alloy films have been electrodeposited directly from their oxide precursors in choline chloride (ChCl)/urea-based deep eutectic solvent (DES). The reaction mechanism and the influence of the cathodic potential on the characteristics of the Cu–Zn alloy films are studied. Cyclic voltammetry and energy dispersive spectroscopy analyses reveal that the reduction of Cu(II) species relatively more preferentially occurs in comparison with the reduction of Zn(II) species, and Cu–Zn codeposition process can be controlled in the DES. Chronoamperometric investigation further confirms that the electrodeposition of Cu–Zn alloy on a Fe electrode follows the three-dimensional instantaneous nucleation-growth process. The micro/nanostructured Cu–Zn alloy films with different phase compositions can be facilely produced by controlling the cathodic potential. The obtained Cu–Zn alloy films typically exhibit enhanced corrosion resistances in 3 wt% NaCl aqueous solution. It is suggested that Cu–Zn alloy films can be sustainably electrodeposited from their abundant and inexpensive oxide precursors in DES. Micro/nanostructured Cu−Zn alloy films have been electrodeposited directly from CuO and ZnO precursors in deep eutectic solvent (DES), the electrochemical reaction mechanism and the nucleation-growth process of Cu−Zn alloy in the DES are investigated.