Semiconductor apparatus and image sensor package using the same

PURPOSE: A semiconductor device and an image sensor package are provided to improve adhesion by forming an uneven part on an adhesion part of the semiconductor device which adheres to a mounting substrate and a transparent member. CONSTITUTION: A body part (100) includes a first surface (102) and a second surface (104). The first surface faces the second surface. A first trench (110) is formed on the first surface of the body part. A second trench (120) is formed on the second surface of the body part. An opening part (130) connects the first trench to the second trench. A first uneven part is formed on the bottom (110b) of the first trench. A second uneven part is formed on the second surface of the body part.