Resistance Instability inCu-damascene Structures during theIsothermal Electromigration Test

TheIsothermal Testisa promising wafer-level toolto characterize electromigration alsoinCu-damascene metallizations, whena correct temperature determination isemployed. Inthis work an improved feedback algorithm isproposed toreduce theobserved resistance instability inthestress phase, whenthecopperstructures areapproaching thefailure.