Wiring board manufacturing method and wiring board manufacturing apparatus

The present invention manufactures a wiring board by: forming a resin base material by laminating resin layers by repeating a resin layer forming step for forming a resin layer on a working table by means of a resin layer forming unit; and performing a wiring layer forming step for forming a wiring layer on the resin layers. In the case of performing the wiring layer forming step just after performing the resin layer forming steps, the resin layer is formed (S230) by radiating linear UV light in the X direction, while transferring the working table in the Y direction at a first transfer speed (low speed), and in the case of sequentially performing the resin layer forming step just after performing the resin layer forming step, the resin layer is formed (S220) by radiating the linear UV light in the X direction, while transferring the working table in the Y direction at a second transfer speed (high speed) that is higher than the first transfer speed.