A process for preparing an electronic assembly and electronic assembly

The invention relates to a method of manufacturing an electronic assembly in which at least one electronic component (2) in an insulating material (2, 5) is at least partially embedded, comprising the steps of: comprises providing a foil arrangement (7), the at least one conductive layer (7) and a support layer (7), - - patterning the conductive layer (7) of the film arrangement such that apertures (8) for receiving bumps (3) are produced, which are connected to the contact surfaces of at least one electronic component (2), - applying an adhesive layer (5) with openings (8) provided with conductive layer, - placing the at least one component (2) on the film arrangement so that the bumps (3) into the openings (8) engage the conductive layer, - partially embedding the at least one component (2) opposite from the bumps (3) side in a dielectric layer (4), - removing the support layer of the film assembly such that the surface of the bumps (3) is exposed, - depositing a metallization layer on the side of the conductive layer with the exposed bumps, - patterning the metallization layer and the conductive layer for the production of conductor tracks (6), which overlap with the bumps (3). The invention further relates to a solution prepared by such a method, electronic assembly.